Microphone module with sound pipe

A microphone package comprising:

• a housing including a microphone chamber with a first aperture and a backchamber with a second aperture, the microphone chamber and the back chamber sharing a common boundary;
• a substrate having a first side and a second side opposite the first side and including the first aperture, the first aperture extending from the first side to the second side to allow acoustic signals to pass through the substrate, the first and second apertures offset, in position, relative to one another;
• a third aperture formed in the common boundary, the third aperture acoustically coupling the microphone chamber to the backchamber, the first aperture and the second aperture configured to allow entry of acoustic signals into the package, wherein the housing is coupled to the second side and covering the first aperture, the housing and second side forming the backchamber, the second aperture of the housing configured to allow the acoustic signals to enter the backchamber;
• an opening extending from the second aperture in the housing, the opening having an open end to receive the sound waves and direct them toward the second aperture in the housing;
• a microphone formed on the substrate housed within the microphone chamber and formed over the first aperture, wherein the opening extends far from the microphone;
• at least one exterior interface pad formed on the second side and outside of the backchamber, the at least one exterior interface pad electrically coupled to the microphone;
• and
• a circuit chip formed on the substrate housed within the microphone chamber.