Communication filter using single crystal acoustic resonator devices

A communication filter device comprising:

• a piezoelectric substrate having a substrate surface region, the piezoelectric substrate having a piezoelectric layer formed overlying a thinned seed substrate;
• a topside metal electrode formed overlying a portion of the substrate surface region;
• a topside micro-trench formed within a portion of the piezoelectric layer;
• one or more bond pads formed overlying one or more portions of the piezoelectric layer;
• a topside metal having a topside metal plug formed within the topside micro-trench and electrically coupled to at least one of the bond pads;
• a thinned top cap structure bonded to the piezoelectric substrate, the thinned top cap structure including an interposer substrate with one or more blind via structures electrically coupled to one or more bottom bond pads, wherein the one or more blind via structures are exposed;
• wherein the one or more bottom bond pads are electrically coupled to the one or more bond pads and the topside metal;
• a first backside trench formed within the thinned seed substrate and underlying the topside metal electrode;
• a second backside trench formed within the thinned seed substrate and underlying the topside micro-trench;
• a backside metal electrode formed underlying one or more portions of the thinned seed substrate, within the first backside trench, and underlying the topside metal electrode;
• a backside metal plug formed underlying one or more portions of the thinned seed substrate, within the second backside trench, and underlying the topside micro-trench, the backside metal plug being electrically coupled to the topside metal plug and the backside metal electrode, wherein the topside micro-trench, the topside metal plug, the second backside trench, and the backside metal plug form a micro-via;
• a backside cap structure bonded to the thinned seed substrate, the backside cap structure underlying the first and second backside trenches;
• one or more top bond pads formed overlying and electrically coupled to the one or more blind vias;
• and
• one or more solder balls formed overlying the one or more top bond pads.

A communication filter device comprising:

• a piezoelectric substrate having a substrate surface region, the piezoelectric substrate having a piezoelectric layer formed overlying a thinned seed substrate;
• a topside metal electrode formed overlying a portion of the substrate surface region;
• a topside micro-trench formed within a portion of the piezoelectric layer;
• one or more bond pads formed overlying one or more portions of the piezoelectric layer;
• a topside metal having a topside metal plug formed within the topside micro-trench and electrically coupled to at least one of the bond pads;
• a top cap structure bonded to the piezoelectric substrate, the top cap structure including a substrate with one or more bottom bond pads;
• wherein the one or more bottom bond pads are electrically coupled to the one or more bond pads and the topside metal;
• a first backside trench formed within the thinned seed substrate and underlying the topside metal electrode;
• a second backside trench formed within the thinned seed substrate and underlying the topside micro-trench;
• a backside metal electrode formed underlying one or more portions of the thinned seed substrate, within the first backside trench, and underlying the topside metal electrode;
• a backside metal plug formed underlying one or more portions of the thinned seed substrate, within the second backside trench, and underlying the topside micro-trench, the bottom topside metal plug being electrically coupled to the topside metal plug, wherein the topside micro-trench, the topside metal plug, the second backside trench, and the backside metal plug form a micro-via;
• a backside cap structure bonded to the thinned seed substrate, the backside cap structure underlying the first and second backside trenches;
• one or more backside bond pads formed within one or more portions of the backside cap structure, the one or more of the backside bond pads being electrically coupled to the backside metal plug;
• and
• one or more solder balls formed underlying the one or more backside bond pads.

A communication filter device comprising:

• a piezoelectric substrate having a substrate surface region, the piezo electric substrate having a piezoelectric layer formed overlying a thinned seed substrate;
• a topside metal electrode formed overlying a portion of the substrate surface region;
• a topside micro-trench formed within a portion of the piezoelectric layer;
• one or more bond pads formed overlying one or more portions of the piezoelectric layer;
• a topside metal having a topside metal plug formed within the topside micro-trench and electrically coupled to at least one of the bond pads;
• a shared backside trench formed within the thinned seed substrate and underlying the topside metal electrode and the topside micro-trench;
• a backside metal electrode formed underlying one or more portions of the thinned seed substrate, within the shared backside trench, and underlying the topside metal electrode;
• and
• a backside metal formed underlying one or more portions of the thinned seed substrate, within the shared backside trench, and underlying the topside micro-trench, the backside metal being electrically coupled to the topside metal plug and the backside metal electrode, wherein the topside micro-trench, the topside metal plug, and the backside metal form a micro-via.