Hybrid photonic plasmonic interconnects (HyPPI) with intrinsic and extrinsic modulation options

An extrinsic hybrid photonic plasmonic system, comprising:

• a plasmonic laser configured to generate light;
• a photonic waveguide configured to propagate an optical signal;
• and
• a plasmonic modulator configured to manipulate the optical signal to load electronic data into the optical signal, to provide a modulated optical signal;
• and
• a plasmonic detector configured to detect the modulated optical signal.

A method for calculating a laser power for photonic, plasmonic and hybrid photonic plasmonic data interconnect systems having a laser, photodetector and a link comprising a waveguide, the method comprising:

• providing the minimum current that is required by a next stage to which the link is connected;
• determining at the photodetector, a minimum light power that is required by the photodetector to generate the minimum current;
• determining at the laser, a minimum laser output power to compensate a channel loss of the waveguide, modulator, coupler and waveguide crosstalk losses;
• and
• determining at the laser, the laser power based on laser efficiency.

A method of benchmarking interconnect performance with on-chip footprint, namely bit flow density (BFD), which is a number of bits transmitted through a certain chip width (cross-section) to reach a specific required communication length, which is highly related to a size of each device and spacing, the method comprising:

• simulating on a processing device, a propagation speed and length for different waveguide sizes;
• simulating on the processing device, a crosstalk leakage among waveguides under different spacing;
• calculating for a specific chip length, a number of signal repeaters that a channel needs to reach the chip length based on a propagation length;
• calculating for a specific chip width, a number of channels that can stack into the chip width based on the device footprint and spacing;
• and
• calculating an overall bit flow density by using a total capacity of all the channels divided by the specific chip area which is the chip length by the chip width.