Interconnect for implantable medical device header

A method of fabricating a modular header for providing electrical connections between an array of feed-through pins extending through a wall of a hermetically sealed enclosure of an implantable medical device and lead connector receptacles within a modular header assembled to said device comprising:

• providing a pre-formed molded header module having paths therein to accept and incorporate a set of flexible conductive traces and connector blocks;
• providing a set of four or more interconnected flexible conductors each having a free end and a fixed end, the fixed end of each flexible conductor being connected to a removable common element shared by all the flexible conductors, and assembling said set of conductors into said recesses by said pre-formed molded header module attaching the free ends thereof to corresponding connector blocks provided in said molded header module;
• performing an over-molding operation to incorporate and hermetically seal said conductors into said header structure;
• and
• removing the common element such that a linear array of the four or more connectors are defined at the fixed ends by the removal of the common element.