Side launch contactless signal conduit structures
AssigneeKeyssa Systems, Inc.
InventorsAlan Besel, Eric Sweetman, Bojana Zivanovic
Life of this patent
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Abstract
Conduit structures for redirecting extremely high frequency (EHF) signals are disclosed herein. The conduit structures discussed herein are designed to re-direct EHF or RF signal energy from a first signal path to a second signal path. The conduit structures according to embodiments discussed herein can re-direct the RF signal energy while simultaneously adhering to specified signaling characteristic of the RF signal and minimizing stray RF signal radiation within a device to support device-to-device contactless communications.
Claims19
An air-filled dielectric conduit structure for use with a contactless communications unit (CCU) mounted to a substrate, wherein the CCU is operative to selectively transmit and receive RF signals along a first path, the conduit structure comprising:
- a dielectric structure comprising an RF interface region, an external tapered region, an internal tapered region, and an air-filled cavity,
- wherein the CCU is capped by the air-filled cavity, and
- wherein a combination of the air-filled cavity and internal and external tapered regions redirects RF signals transmitted by the CCU along the first path to the RF interface region via a second path and redirects RF signals received via the RF interface region along the second path to the CCU via the first path.
A dielectric insert dielectric conduit structure for use with a contactless communications unit (CCU) mounted to a substrate, wherein the CCU is operative to selectively transmit and receive RF signals along a first path, the conduit structure comprising:
- a metallized cover constructed to be mounted to the substrate and to cover the CCU, the metallized cover comprising an opening through which the RF signals travel along a second path;
- and
- a dielectric insert constructed to be secured within the metallized cover and to be positioned adjacent to the CCU, the dielectric insert comprising an RF interface positioned adjacent to the opening, wherein a combination of the metallized cover and the dielectric insert redirects RF signals transmitted by the CCU along the first path to the RF interface region via the second path and redirect RF signal received via the RF interface region along the second path to the CCU via the first path, wherein the metallized cover comprises an interior volume, and wherein the dielectric insert occupies a substantial portion of the interior volume.
A system comprising:
- a substrate;
- a plurality of contactless communications units (CCUs) mounted to the substrate, wherein the CCUs are operative to selectively transmit and receive RF signals along respective first paths, wherein the RF signals comprise RF radiation;
- and
- a plurality of RF signal redirection structures, each structure mounted over one of the plurality of CCUs and secured to the substrate, wherein each RF signal redirection structure is operative to redirect RF signals from the first path to a second path or redirect RF signals from the second path to the first path for each CCU.
Dependencies are inferred from the claim text.