Organic EL panel and method for producing same

A method for producing an organic EL panel in which an encapsulation layer is provided, without a gap, between an encapsulation substrate and an element formation substrate on which an organic EL element is formed, characterized in that the method comprises:

• a preparation step of heating and drying a desiccant and a gel resin, adding the desiccant to the resin at a weight ratio of 0.3% or more and 10% or less to form an inner hygroscopic agent which is to be arranged in a portion of the encapsulation substrate opposed to the organic EL element, adding the desiccant to the resin at a weight ratio of 10% or more and 80% or less to form an outer periphery hygroscopic agent which is to be arranged to surround the inner hygroscopic agent, and stirring, cooling, and filtering the inner hygroscopic agent and the outer periphery hygroscopic agent;
• an application step of independently applying the inner hygroscopic agent, the outer periphery hygroscopic agent, a peripheral adhesive, and a fixative being an ultraviolet-curable resin in an inert environment in which an amount of moisture is lower than a predetermined amount, the peripheral adhesive being an ultraviolet-curable resin arranged to surround the outer periphery hygroscopic agent;
• an alignment step of loading the element formation substrate and the encapsulation substrate into a bonding chamber and aligning the element formation substrate and the encapsulation substrate with the element formation substrate and the encapsulation substrate spaced away from each other;
• a heating step of heating the encapsulation substrate on which the inner hygroscopic agent, the outer periphery hygroscopic agent, the peripheral adhesive, and the fixative are applied;
• a defoaming step of evacuating the bonding chamber to remove gas entrapped in the inner hygroscopic agent, the outer periphery hygroscopic agent, the peripheral adhesive, and the fixative;
• a pressure-bonding step of clamping the element formation substrate and the encapsulation substrate with paired surface plates, pressure-bonding the element formation substrate and the encapsulation substrate with the paired surface plates by applying predetermined load, controlling the load such that an inner portion surrounded by the peripheral adhesive is filled with the inner hygroscopic agent and the outer periphery hygroscopic agent, and forming the encapsulation layer having a predetermined thickness between the element formation substrate and the encapsulation substrate;
• a gas introduction step of introducing an inert gas into the bonding chamber to set a surrounding environment of the pressure-bonded element formation substrate and encapsulation substrate to an atmospheric pressure environment;
• a temporary fixation step of irradiating the fixative with an ultraviolet ray from a back side of one of the surface plates by using an ultraviolet spot lamp to cure the fixative and temporarily fix the element formation substrate and the encapsulation substrate to each other;
• and
• a sealing curing step of irradiating the peripheral adhesive applied on the substrate temporarily fixed in the temporary fixation step with an ultraviolet ray to cure the peripheral adhesive.