Composition and method for preparation of organic electronic devices
AssigneeMerck Patent GmbH
InventorsMark James, Magda Goncalves-Miskiewicz, Philip E. May, Lana Nanson, Ruth Effenberger, Edgar Kluge
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AssigneeMerck Patent GmbH
InventorsMark James, Magda Goncalves-Miskiewicz, Philip E. May, Lana Nanson, Ruth Effenberger, Edgar Kluge
Estimating the term…
The present invention relates to novel compositions comprising an organic semiconductor (OSC) and one or more organic solvents. The composition is solid at a temperature of 25° C. and fluid at a higher temperature and the boiling point of the solvent is at most 400° C. Furthermore, the present invention describes the use of these compositions as inks for the preparation of organic electronic (OE) devices, especially organic photovoltaic (OPV) cells and OLED devices, to methods for preparing OE devices using the novel compositions, and to OE devices, OLED devices and OPV cells prepared from such methods and compositions.
A composition comprising one or more organic semiconducting compounds (OSC), including an organic phosphorescent compound that emits light and includes at least one atom having an atomic number greater than 38 and less than 84, and at least 70% by weight of one or more organic solvents, said organic solvents including an aromatic and/or heteroaromatic compound having a molecular weight of at least 120 g/mol, and a melting point of 50° C. or above and a melting point of 200° C. or less, wherein said composition is solid at a temperature of 50° C., and the boiling point of the solvent is at most 400° C.
A composition comprising one or more organic semiconducting compounds (OSC), including an organic phosphorescent compound that emits light and includes at least one atom having an atomic number greater than 38 and less than 84, and at least 70% by weight of one or more organic solvents, said organic solvents including an aromatic and/or heteroaromatic compound having a molecular weight of at least 120 g/mol, and a melting point of 50° C. or above and a melting point of 200° C. or less, wherein said composition is solid at a temperature of 50° C., and has a surface tension in the range of 20 mN/m to 60 mN/m, and a viscosity in the range of 1.0 to 40 mPas, at a temperature 10° C. above the melting point of the one or more solvents having the highest boiling point.
Dependencies are inferred from the claim text.