LED device, LED module and ultraviolet light emitting device

An LED device comprising:

• a substrate;
• an LED element disposed on the substrate;
• an inorganic glass molded body disposed at a position where all or a part of light which is emitted from the LED element passes through;
• a first bonding portion that is provided in contact with the substrate and bonds the substrate and the inorganic glass molded body;
• and
• a second bonding portion provided between the LED element and the inorganic glass molded body,
• wherein the LED element is shielded from outside air by the substrate, the inorganic glass molded body and the first bonding portion;
• wherein the second bonding portion comprises a cured product of a condensation polymerization-type silicone resin;
• wherein a distance between the first bonding portion and the LED element is 0 mm or more and 0.5 mm or less;
• and
• wherein a distance between the LED element and the inorganic glass molded body is 0.1 mm or less.