High hole mobility transistor
AssigneeVanguard International Semiconductor Corporation
InventorsFu-Hsin Chen, Yung-Hao Lin, Shin-Cheng Lin, Hsin-Chih Lin, Chia-Ching Huang
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AssigneeVanguard International Semiconductor Corporation
InventorsFu-Hsin Chen, Yung-Hao Lin, Shin-Cheng Lin, Hsin-Chih Lin, Chia-Ching Huang
Estimating the term…
A high hole mobility transistor includes a substrate, a back-barrier layer, a conducting layer, a doping layer, a gate electrode, source/drain electrodes, and a band adjustment layer. The back-barrier layer is disposed on the substrate. The conducting layer is disposed on the back-barrier layer. A channel region is disposed in the conducting layer and is adjacent to the interface between the conducting layer and the back-barrier layer. The doping layer is disposed on the conducting layer. The gate electrode is disposed on the doping layer. The source/drain electrodes are disposed on opposite sides of the gate electrode. The band adjustment layer is disposed on the doping layer and electrically connected to the gate electrode. The band adjustment layer is an N-type doped III-V semiconductor.
A high hole mobility transistor (HHMT), comprising:
Dependencies are inferred from the claim text.