Solid-state imaging device, manufacturing method thereof, and electronic apparatus
AssigneeSony Corporation
InventorYosuke Ogata
Life of this patent
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Abstract
Disclosed is a solid-state imaging device including: a solid-state imaging element which outputs an image signal according to an amount of light sensed on a light sensing surface; a semiconductor element which performs signal processing with respect to the image signal output from the solid-state imaging element; and a substrate which is electrically connected to the solid-state imaging element and the semiconductor element, in which the semiconductor element is sealed by a molding resin in a state of being accommodated in an accommodation area which is provided on the substrate, and in which the solid-state imaging element is layered on the semiconductor element via the molding resin.
Claims12
A solid-state imaging device, comprising:
- a solid-state imaging element;
- a semiconductor element;
- and
- a substrate, wherein the semiconductor element is located within an accommodation area of the substrate,
- wherein the substrate is electrically connected to the solid-state imaging element and the semiconductor element,
- wherein the semiconductor element is connected to the substrate by a molding resin, and
- wherein the solid-state imaging element is disposed on a surface of the molding resin and is connected to the semiconductor element via the molding resin.
A manufacturing method of a solid-state imaging device which has a solid-state imaging element which outputs an image signal according to an amount of light sensed on a light sensing surface, a semiconductor element which performs signal processing with respect to the image signal output from the solid-state imaging element, and a substrate which is electrically connected to the solid-state imaging element and the semiconductor element and which includes an accommodation area, the method comprising:
- sealing the semiconductor element using a molding resin in the accommodation area of the substrate;
- and
- layering the solid-state imaging element on the semiconductor element via the molding resin.
An electronic apparatus, comprising:
- a solid-state imaging device that includes:
- a solid-state imaging element;
- a semiconductor element;
- and
- a substrate,
- wherein the semiconductor element is located within an accommodation area of the substrate,
- wherein the substrate is electrically connected to the solid-state imaging element and the semiconductor element,
- wherein the semiconductor element is connected to the substrate by a molding resin., and
- wherein the solid-state imaging element is layered on the semiconductor element via the molding resin.
Dependencies are inferred from the claim text.