Light emitting device package

A light emitting device package comprising:

• a plurality of light emitting chips configured to emit respective wavelength lights, each chip comprising electrodes at a bottom of the chip;
• a plurality of wirings connected to the electrodes of the chips, respectively;
• a plurality of electrode pads disposed below the chips, and connected to the wirings, respectively;
• a molding member integrally formed in a single layer structure to cover upper surfaces and side surfaces of the chips, and comprising a material having a predetermined transmittance;
• and
• at least one of a metal layer disposed above the molding member, a colored lower layer disposed below the molding member, and a partition structure surrounding the chips.

A light emitting device package comprising a plurality of pixel sets, wherein at least one of the pixel sets comprises:

• a first pixel region comprising:
• a plurality of first light emitting chips configured to emit respective wavelength lights;
• a plurality of first wirings connected to the first chips, respectively, and comprising a first common wiring commonly connected to the first chips;
• and
• a plurality of first electrode pads disposed below the first chips, and connected to the first wirings, respectively;
• a second pixel region adjacent to the first pixel region and comprising:
• a plurality of second light emitting chips configured to emit the respective wavelength lights;
• a plurality of second wirings connected to the second chips, respectively, and comprising a second common wiring commonly connected to the second chips;
• and
• a plurality of second electrode pads disposed below the second chips, and connected to the second wirings;
• and
• a molding member disposed above the first pixel region and the second pixel region, and comprising a translucent material,
• wherein the first pixel region shares at least one of the first electrode pads included therein with the second pixel region such that at least one of the second wirings included in the second pixel region is connected to the shared electrode pad in the first pixel region.