Semiconductor package structure and method for forming the same
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, Ching-Wen Hsiao, I-Hsuan Peng
Life of this patent
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Abstract
A semiconductor package structure has a first electronic component on an insulating layer, a dielectric layer on the insulating layer and surrounding the first electronic component, a second electronic component stacked on the first electronic component, wherein an active surface of the first electronic component faces an active surface of the second electronic component, a molding compound on the first electronic component and surrounding the second electronic component, a third electronic component stacked on the second electronic component and the molding compound.
Claims22
A semiconductor package structure, comprising:
- a first electronic component on an insulating layer;
- a dielectric layer on the insulating layer and surrounding the first electronic component;
- a second electronic component stacked on the first electronic component, wherein an active surface of the first electronic component faces an active surface of the second electronic component;
- a molding compound on the first electronic component and surrounding the second electronic component;
- a third electronic component stacked on the second electronic component and the molding compound;
- and
- a conductive layer on the substrate, wherein a bottom surface of a portion of the conductive layer is non-coplanar with a bottom surface of another portion of the conductive layer.
A semiconductor package structure, comprising:
- a first electronic component on an insulating layer;
- a dielectric layer on the insulating layer and surrounding the first electronic component;
- a second electronic component stacked on the first electronic component, wherein an active surface of the first electronic component faces an active surface of the second electronic component;
- a molding compound on the dielectric layer and surrounding the second electronic component;
- a first conductive layer on the molding compound;
- and
- a second conductive layer extending over a top surface of the dielectric layer, wherein the second conductive layer extends into openings in the dielectric layer.
Dependencies are inferred from the claim text.