US 10,256,206 B2 · Qubit die attachment using preforms

Abstract

Embodiments of the present disclosure describe novel qubit device packages, as well as related computing devices and methods. In one embodiment, an exemplary qubit device package includes a qubit die and a package substrate, where the qubit die is coupled to the package substrate using one or more preforms. In particular, a single preform may advantageously be used to replace a plurality of individual contacts, e.g. a plurality of individual solder bumps, electrically coupling the qubit die to the package substrate. Such packages may reduce design complexity and undesired coupling, and enable inclusion of larger numbers of qubits in a single qubit die.

Claims20

Dependent claims

A qubit device package, comprising:

a qubit die having a first face and an opposing second face, where the qubit die includes one or more qubit devices, and where the first face of the qubit die includes a plurality of conductive contacts;
a package substrate having a first face and an opposing second face, where the second face of the package substrate includes a plurality of conductive contacts;
and
an interconnect structure, coupling two or more of the plurality of conductive contacts at the first face of the qubit die with associated two or more conductive contacts at the second face of the package substrate.

1 more element

Dependencies are inferred from the claim text.

Qubit die attachment using preforms

Life of this patent

Qubit die attachment using preforms

Life of this patent

Abstract

Claims20