US 10,256,205 B2 · Variable ball height on ball grid array packages by solder paste transfer

Abstract

BGA packages with a spatially varied ball height, molds and techniques to form such packages. A template or mold with cavities may be pre-fabricated to hold solder paste material applied to the mold, for example with a solder paste printing process. The depth and/or diameter of the cavities may be predetermined as a function of spatial position within the mold working surface area. Mold cavity dimensions may be specified corresponding to package position to account for one or more pre-existing or expected spatial variations in the package, such as a package-level warpage measurement. Any number of different ball heights may be provided. The molds may be employed in a standardize process that need not be modified with each change in the mold.

Claims5

Dependent claims

An integrated circuit (IC) package, comprising:

one or more integrated circuit chips coupled to a chip-side of a package substrate;
and
a plurality of solder features disposed over a land-side of the package substrate, opposite the chip-side, wherein:
the solder features include a first solder feature having a first height and a second solder feature having a second height, the second height exceeding the first height by more than 25% of the first height;
and
the first and second solder features have voids of at least 15% of their respective solder areas.

3 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/812,754Filed 14 Nov 2017 · division

Priority

28 Mar 2016

Published

US 2018/0068969 A18 Mar 2018

Granted

9 Apr 2019

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10W 90/701
Package configurations: characterised by the relative positions of pads or connectors relative to package parts
H10W 70/098
Of insulating or insulated package substrates, or of interposers, or of redistribution layers: applying pastes or inks, e.g. screen printing
H10W 70/099
Package substrates; Interposers; Redistribution layers [RDL]: connecting interconnections to insulating or insulated package substrates,…
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections

Variable ball height on ball grid array packages by solder paste transfer

Life of this patent

Variable ball height on ball grid array packages by solder paste transfer

Life of this patent

Abstract

Claims5