Semiconductor device and semiconductor package

A semiconductor device, comprising:

• a die, comprising a plurality of first pads and a plurality of second pads;
• a passivation layer, disposed on the die and exposing the first pads and the second pads;
• a conductive frame, disposed on the passivation layer and comprising a plurality of first vias penetrating the passivation layer to contact the first pads respectively and a plurality of second vias entirely disposed on top of the passivation layer and connected to the first pads through the conductive frame;
• and
• a plurality of third vias penetrating the passivation layer to contact the second pads respectively.

A semiconductor package, comprising:

• a molded semiconductor device comprising a semiconductor device and a molding compound encapsulating the semiconductor device, the semiconductor device comprising:
• a die, comprising a plurality of first pads and a plurality of second
• a passivation layer, disposed on the die and exposing the first pads and the second pads;
• a conductive frame, disposed on the passivation layer and comprising a plurality of first vias penetrating the passivation layer to contact the first pads respectively and a plurality of second vias disposed on top of the passivation layer and connected to the first pads through the conductive frame;
• and
• a plurality of third vias penetrating the passivation layer to contact the second pads;
• and
• a redistribution structure, disposed on the molded semiconductor device and comprising a plurality of first redistribution vias, wherein a first set of the first redistribution vias connect the first vias and a second set of the first redistribution vias connect the second vias.