Bonding pad structure having island portions and method for manufacturing the same

A method for fabricating a bonding pad structure, comprising:

• forming a dielectric layer on a substrate;
• forming a first metal pattern layer in the dielectric layer, wherein the first metal pattern layer comprises:
• a first body portion having a plurality of first openings in a central region of the first body portion and a plurality of second openings arranged along a peripheral region of the first body portion and surrounding the plurality of first openings;
• and
• a plurality of first island portions correspondingly disposed in the plurality of second openings and spaced apart from the first body portion, wherein each of the plurality of first island portions is surrounded by the first body portion in the plan view;
• forming a plurality of first interconnect structures in the dielectric layer and corresponding to the plurality of first island portions, wherein each of the first interconnect structures comprises at least one via plug;
• and
• forming a bonding pad on the dielectric layer and directly above the first metal pattern layer, such that the bonding pad is electrically connected to the plurality of first island portions through the plurality of first interconnect structures.