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US 10,256,200 B2Granted
Electronic component package and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsDae Hyun Park, Han Kim, Kang Heon Hur, Young Gwan Ko, Jung Ho Shim
Life of this patent
Estimating the term…
Abstract
An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.
Claims20
An electronic component package comprising:
- a frame having a through-hole, and including:
- a first insulating layer having first and second surfaced opposing each other;
- a first via penetrating the first insulating layer, and having a size decreasing from the first and second surfaces of the first insulating layer to an inner portion of the first via;
- a first layer disposed on the first surface of the first insulating layer and being in contact with the first via;
- a second insulating layer disposed on the first insulating layer and partially embedding the first wiring layer;
- a second via penetrating the second insulating layer;
- and
- a second wiring layer disposed on the second insulation layer, being in contact with the second via, and electrically connected to the first wiring layer through the second via which has a size decreasing from the second wiring layer to the first wiring layer;
- an electronic component disposed in the through-hole of the frame;
- and
- a redistribution part disposed on one side of the frame and the electronic component,
- wherein the first and second wiring layers are electrically connected to the electronic component through the redistribution part, and are disposed on levels between upper and lower surfaces of the electronic component.
9 more elements
An electronic component package comprising:
- a frame having a through-hole, and including:
- a first insulating layer having first and second surfaces opposing each other;
- a first via penetrating the first insulating layer, and having a size decreasing from the first and second surfaces of the first insulating layer to an inner portion of the first via;
- a first wiring layer disposed on the first surface of the first insulating layer and being in contact with the first via;
- a second insulating layer disposed on the first insulating layer and partially embedding the first wiring layer;
- a second via penetrating the second insulating layer;
- and
- a second wiring layer disposed on the second insulating layer, being in contact with the second via, and electrically connected to the first wiring layer through the second via which has a size decreasing from the second wiring layer to the first wiring layer;
- an electronic component disposed in the through-hole of the frame;
- and
- a redistribution part including an insulating layer and a redistribution wiring layer,
- wherein the frame and the electronic component are disposed on the insulating layer of the redistribution part,
- the first and second wiring layers are electrically connected to the electronic component through the redistribution wiring layer, and
- the second wiring layer is partially embedded in the insulating layer of the redistribution wiring layer.
11 more elements
An electronic component package comprising:
- a frame having a through-hole and including a first insulating layer, first to third wiring layers, and a metal layer disposed on an inner surface of the through-hole and electrically connected to a portion of the first wiring layer, a portion of the second wiring layer, and a portion of third wiring layer;
- an electronic component disposed in the through-hole of the frame;
- and
- a redistribution part including an insulating layer and a redistribution wiring layer,
- wherein the insulating layer of the redistribution part is disposed on the frame and the electronic component,
- signal patterns of the first to third wiring layers are electrically connected to the electronic component through the redistribution wiring layer and are disposed on levels different from each other with respect to the insulating layer of the redistribution part,
- the second wiring layer is partially embedded in the insulating layer of the redistribution wiring layer, and
- a thickness of the first insulating layer is greater than a thickness of the insulating layer of the redistribution part.
5 more elements
Dependencies are inferred from the claim text.