US 10,256,195 B2Granted

Module and method for manufacturing same

AssigneeMurata Manufacturing Co., Ltd.

InventorsIssei Yamamoto, Atsushi Shimizu, Yoichi Takagi, Hideo Nakagoshi

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Abstract

A module includes a wiring board, a plurality of components mounted on an upper surface of the wiring board, a sealing resin layer which seals the components provided on the upper surface of the wiring board, and a shield layer provided so as to cover a surface of the sealing resin layer. The shield layer includes an adhesion layer which is stacked on the surface of the sealing resin layer and includes a first adhesion film composed of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl, a conductive layer which is stacked on the adhesion layer, and a protective layer which is stacked on the conductive layer and includes a protective film composed of a nitride, oxide, or oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl.

Claims13

Dependent claims

A module comprising:

a wiring board;
a component mounted on a principal surface of the wiring board;
a sealing resin layer provided on the principal surface of the wiring board and covering the component;
and a shield layer provided so as to cover a surface of the sealing resin layer, wherein the shield layer includes:
an adhesion layer stacked over the surface of the sealing resin layer and including a first adhesion film composed of a metal selected from a group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl;
a conductive layer stacked over the adhesion layer;
and a protective layer stacked over the conductive layer and including a protective film composed of a nitride, an oxide or an oxynitride of a metal selected from the group consisting of Ti, Cr, Ni, TiCr, TiAl, NiAl, CrAl, and CrNiAl;
wherein the protective film is composed of a nitride, an oxide or an oxynitride of a same metal as the metal of the first adhesion film.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/846,541Filed 19 Dec 2017 · continuation
Priority: JP 2015-12347219 Jun 2015
Published: US 2018/0108618 A119 Apr 2018
Granted: 9 Apr 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification26 codes

H10W 42/20
Arrangements for protection of devices: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
C23C 14/0036
Reactive sputtering or evaporation: reactive sputtering
C23C 14/0641
Characterised by the coating material: nitrides
C23C 14/14
Characterised by the coating material: metallic material, boron or silicon