Methods and devices with enhanced grounding and shielding for wire bond structures

A semiconductor device, comprising:

• a package substrate;
• a semiconductor die attached to a first major surface of the package substrate;
• a plurality of wire bonds attached between the semiconductor die and the first major surface of the package substrate;
• a conductive plate over the semiconductor die, plurality of wire bonds, and package substrate wherein a first major surface of the conductive plate faces the first major surface of the package substrate;
• a plurality of conductive extensions attached to the first major surface of the conductive plate and electrically coupled to the conductive plate, wherein each conductive extension includes a wire which extends from the first major surface of the conductive plate and between two wire bonds of the plurality of wire bonds, wherein, each wire loops back to the first major surface of the conductive plate and is connected, at both ends, to the first major surface of the conductive plate.