Fan-out semiconductor package

A fan-out semiconductor package, comprising:

• a first connection member having a through-hole;
• a semiconductor chip disposed in the through-hole of the first connection member and having an active surface including connection pads disposed thereon and an inactive surface opposite the active surface;
• a component-embedded substrate disposed in the through-hole of the first connection member and spaced apart from the semiconductor chip, and including a passive component embedded therein;
• an encapsulant encapsulating portions of the first connection member, the component-embedded substrate, and the semiconductor chip;
• and
• a second connection member disposed on the first connection member, the component-embedded substrate, and the active surface of the semiconductor chip,
• wherein the first connection member and the second connection member include, respectively, redistribution layers electrically connected to the connection pads of the semiconductor chip, and
• the component-embedded substrate further an insulating layer disposed on the passive component and having opening exposing portions of the passive component, a wiring layer disposed on the insulating layer and connected to the passive component through vias filling the openings in the insulating layer,
• the insulating layer includes an upper surface facing the passive component, a lower surface on which the wiring layer is disposed, and a side surface connecting the upper and lower surfaces to each other and being in contact with the encapsulant, and
• the passive component is electrically connected to the connection pads of the semiconductor chip through the redistribution layer of the second connection member, and the wiring layer and the via of the component-embedded substrate.