Switched power stage with integrated passive components

A multi-layer substrate package for providing at least one inductor for a switching voltage regulator of a flip-chip type Integrated Circuit (IC) chip comprising:

• the flip-chip type integrated circuit (IC) chip including the switching voltage regulator, the switching voltage regulator including at least a high side switch and a low side switch coupled in series between a higher voltage level connection and a lower voltage level connection;
• the multi-layer substrate package including a plurality of redistribution layers between a first surface on a first side and a second surface on a second side of the plurality of redistribution layers with a cavity defined in the plurality of redistribution layers, a first inductor in the cavity, the first inductor formed by a plurality of conductive traces interspersed by ferrite material, the first inductor including a first end and a second end;
• and
• a plurality of micro-bumps on the first surface of the plurality of redistribution layers, the plurality of micro-bumps connecting the flip-chip type IC chip and the multi-layer substrate package, the plurality of micro-bumps including a first inductor input micro-bump connecting a node between the high side switch and the low side switch to the first end of the first inductor and an inductor output micro-bump coupled to a second end of the first inductor.