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US 10,256,179 B2Granted
Package structure and manufacturing method thereof
AssigneeNanya Technology Corporation
InventorPo-Chun Lin
Life of this patent
Estimating the term…
Abstract
A package structure includes an interconnection layer; a passivation layer disposed on the interconnection layer, in which the interconnection layer and the passivation layer defined at least one opening; at least one elastic bump disposed on the interconnection layer, in which a portion of the elastic bump is embedded in the opening; and a conductive layer disposed on the elastic bump.
Claims11
A package structure, comprising:
- an interconnection layer;
- a pad disposed in the interconnection layer;
- a first passivation layer disposed on the interconnection layer, wherein the first passivation layer has at least one first opening and a second opening, the second opening exposes the pad;
- at least one elastic bump disposed on the interconnection layer, wherein a portion of the elastic bump is embedded in the first opening, and the portion of the elastic bump extends below the first passivation layer;
- and
- a conductive layer disposed on the elastic bump and the first passivation layer, wherein the conductive layer is in contact with the pad through the second opening, the elastic bump is between the first passivation layer and the conductive layer, and the conductive layer covers a top surface of the elastic bump.
3 more elements
Dependencies are inferred from the claim text.