US 10,256,178 B2Granted

Vertical and horizontal circuit assemblies

AssigneeFairchild Semiconductor Corporation

InventorsJerome Teysseyre, Romel Manatad, Chung-Lin Wu, Bigildis Dosdos, Erwin Ian Almagro, Maria Cristina Estacio

Life of this patent

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Abstract

In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.

Claims20

Dependent claims

An apparatus comprising:

a leadframe including a plurality of leads configured to be coupled with a printed circuit board, the plurality of leads being disposed along a single edge of the apparatus;
an assembly including a substrate and a plurality of semiconductor die disposed on the substrate, the assembly being mounted on the leadframe;
and
an inductor having a coil portion, a first terminal and a second terminal,
the coil portion of the inductor being disposed on a first side of the apparatus,
the first terminal of the inductor being coupled with the leadframe via a first contact pad, the first contact pad being disposed on a second side of the apparatus that is opposite the first side of the apparatus,
the second terminal of the inductor being coupled with the leadframe via a second contact pad, the second contact pad being disposed on the second side of the apparatus, and
the leadframe, the assembly and the inductor being arranged in a stacked configuration.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/692,354Filed 31 Aug 2017 · us provisional application
Priority: 6 Sep 2016
Published: US 2018/0068935 A18 Mar 2018
Granted: 9 Apr 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10W 70/635
Vias, e.g. via plugs: through-vias
H10W 70/40
Package substrates; Interposers; Redistribution layers [RDL]: leadframes
H10W 70/458
Materials: of insulating layers on leadframes
H10W 90/811
Package configurations: multiple chips on leadframes