Printed wiring board and method for manufacturing printed wiring board

A method for manufacturing a printed wiring board, comprising:

• forming a conductor layer on a metal foil provided on a base plate;
• laminating, on the conductor layer, at least one set of a resin insulating layer and a conductor layer, such that a laminate comprising the conductor layers and resin insulating layer is formed to have a first surface and a second surface on a metal foil side on an opposite side with respect to the first surface;
• forming a solder resist layer on the first surface of the laminate;
• positioning a support plate on the first surface of the laminate such that the solder resist layer is interposed between the laminate and the support plate;
• removing the base plate from the laminate;
• and
• etching the metal foil on the laminate such that the metal foil is removed from the laminate,
• wherein the forming of the conductor layer on the metal foil includes forming a plurality of second conductor pads on the metal foil, the forming of the laminate includes forming a plurality of first conductor pads on a first surface side of the laminate, the removing of the metal foil includes exposing surfaces of the second conductor pads and forming the surfaces of the second conductor pads recessed from the second surface of the laminate respectively, the forming of the conductor layer on the metal foil includes forming a plurality of third conductor pads on the metal foil such that the third conductor pads are positioned on an outer peripheral side than the plurality of second conductor pads, and the removing of the metal foil includes exposing surfaces of the third conductor pads and forming the surfaces of the third conductor pads recessed from the second surface of the laminate respectively.