Semiconductor device and method for manufacturing the same

A semiconductor device, comprising:

• a substrate having a first surface and a second surface opposite to the first surface, the substrate comprising at least one ball pad;
• a package body disposed adjacent to the first surface of the substrate, the package body defining at least one cavity, wherein the cavity includes a first portion and a second portion;
• a device spaced apart from the substrate;
• at least one connecting element connecting the substrate and the device, wherein each connecting element includes a first portion and a second portion, the first portion of the connecting element fills the first portion of the cavity and contacts a respective ball pad, the second portion of the connecting element is in the second portion of the cavity, a space is defined between a periphery surface of the second portion of the connecting element and a sidewall of the second portion of the cavity, and the second portion connects to the device;
• and
• a sensor plate attached and electrically connected to the second surface of the substrate, wherein the sensor plate is a glass plate.

A semiconductor device, comprising:

• a substrate having a first surface and a second surface opposite to the first surface, and including at least one pad disposed thereon;
• a sensor plate attached and electrically connected to the second surface of the substrate, wherein the sensor plate is a glass plate;
• a first package body disposed adjacent to the first surface of the substrate, the first package body defining at least one cavity, wherein the cavity includes a first portion and a second portion;
• and
• at least one connecting element disposed adjacent to the first surface of the substrate and in a corresponding cavity, wherein a space is defined between a periphery surface of a portion of the connecting element and a sidewall of a portion of the cavity, the connecting element includes a core portion and a periphery portion covering the core portion, a material of the core portion has a melting temperature that is higher than a melting temperature of a material of the periphery portion, the connecting element includes a first portion and a second portion, the first portion of the connecting element fills the first portion of the cavity and contacts the pad, the second portion of the connecting element is in the second portion of the cavity, the space is between a periphery surface of the second portion of the connecting element and a sidewall of the second portion of the cavity, a curvature of a sidewall of the first portion of the cavity and a curvature of the sidewall of the second portion of the cavity are discontinuous, a maximum lateral width of the second portion of the cavity is greater than a maximum lateral width of the first portion of the cavity, a curvature of a periphery surface of the first portion of the connecting element and a curvature of the periphery surface of the second portion of the connecting element are discontinuous, a maximum lateral width of the second portion of the connecting element is greater than a maximum lateral width of the first portion of the connecting element, and an end portion of the connecting element extends beyond an outermost surface of the first package body.