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US 10,256,172 B2Granted
Recessed lead leadframe packages
AssigneeSemiconductor Components Industries, LLC
InventorFrancois Ricodeau
Life of this patent
Estimating the term…
Abstract
Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip.
Claims20
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one of the plurality of leads comprises a thinned portion adjacent to the semiconductor chip and is an at least one thinned lead;
- wherein the at least one thinned lead electrically couples with a high voltage connector of the semiconductor chip;
- and
- wherein the plurality of leads, except for the at least one thinned lead, mechanically couple to the semiconductor chip through a die bonding material.
2 more elements
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one of the plurality of leads comprises a thinned portion across a thickness of the lead and is an at least one thinned lead;
- wherein the at least one thinned lead electrically couples with a high voltage connector of the semiconductor chip;
- and
- wherein the plurality of leads, except for the at least one thinned lead, mechanically couple to the semiconductor chip through a die bonding material.
2 more elements
A chip-on-lead package comprising:
- a leadframe coupled to a semiconductor chip, the leadframe comprising a plurality of leads extending inwardly into an opening in the leadframe surrounded by the plurality of leads;
- wherein at least one of the plurality of leads comprises a thinned portion and is an at least one thinned lead;
- wherein the at least one thinned lead electrically couples with a high voltage connector of the semiconductor chip;
- and
- wherein the thinned lead is configured to not directly mechanically couple at a surface of the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.