Electronic device for vehicle
AssigneeDenso Corporation
InventorsTetsuya Sueyoshi, Hiroaki Ando
Life of this patent
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Abstract
An electronic device for a vehicle includes a substrate and a semiconductor package. The substrate is arranged to extend along a flowing path of wind produced by a fan unit. The semiconductor package is disposed on the substrate to be cooled by the wind. When an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area.
Claims14
An electronic device for a vehicle comprising:
- a flexible substrate arranged to extend along a flowing path of wind produced by a fan unit;
- and
- a semiconductor package disposed on the flexible substrate to be cooled by the wind, wherein
- when an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area,
- the flexible substrate electrically connects a touch panel operated by a user to a printed-circuit board on which an electronic component is mounted,
- the flexible substrate inclines upwardly between the touch panel and the printed-circuit board, and
- the inflow port is located between the touch panel and the printed-circuit board in a thickness direction of the printed-circuit board, and the printed-circuit board is located between the inflow port and the semiconductor package in the thickness direction of the printed-circuit board.
An electronic device for a vehicle comprising:
- a flexible substrate arranged to extend along a flowing path of wind produced by a fan unit;
- a reinforcing board configured to reinforce the flexible substrate;
- and
- a semiconductor package disposed on the flexible substrate to be cooled by the wind, wherein
- when an inflow port from which the wind is drawn by the fan unit is defined to include a flowing path having a first cross-section area, the semiconductor package is disposed in a space including a flowing path having a cross-section area that is larger than the first cross-section area,
- the flexible substrate electrically connects a touch panel operated by a user to a printed-circuit board on which an electronic component is mounted,
- the flexible substrate inclines upwardly between the touch panel and the printed-circuit board, and
- the inflow port is located between the touch panel and the printed-circuit board in a thickness direction of the printed-circuit board, and the printed-circuit board is located between the inflow port and the semiconductor package in the thickness direction of the printed-circuit board.
Dependencies are inferred from the claim text.