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US 10,256,169 B2Granted
Semiconductor device
AssigneeFuji Electric Co., Ltd.
InventorsNaoyuki Kanai, Tatsuhiko Asai
Life of this patent
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Abstract
A highly-reliable semiconductor device has improved adhesion between a sealing material and a sealed metal member and/or a case member. In some implementations, the semiconductor device includes: a laminated substrate on which a semiconductor element is mounted; and a sealing material. In some implementations, the sealing material contains an epoxy base resin, a curing agent, and a phosphonic acid.
Claims20
A semiconductor device comprising:
- a laminated substrate on which a semiconductor element is mounted;
- and
- a sealing material, wherein the sealing material contains an epoxy base resin, a curing agent, and a phosphonic acid containing at least one phosphonyl group, —P(═O)(OH)2, and containing a carboxyl group and/or an amino group.
A resin composition for sealing an electronic device comprising:
- an epoxy resin;
- a curing agent;
- and
- a phosphonic acid containing at least one phosphonyl group, —P(═O)(OH)2, and containing a carboxyl group and/or an amino group.
1 more element
Dependencies are inferred from the claim text.