Method of processing wafer

A method of processing a wafer, having on one side a device area with a plurality of devices partitioned by a plurality of division lines and a peripheral marginal area having no devices and being formed around the device area, wherein the device area is formed with a plurality of protrusions protruding from a plane surface of the wafer and the protrusions define an uneven surface topography, the method comprising:

• attaching a solid flexible protective film to the one side of the wafer, so as to closely follow at least upper portions of contours of the protrusions, wherein the solid flexible protective film is expandable and is adhered with an adhesive, the solid flexible protective film being expanded when being attached to the one side of the wafer so as to follow the uneven surface topography;
• providing a carrier having a curable resin applied to a front surface thereof;
• attaching the one side of the wafer, having the solid flexible protective film attached thereto, to the front surface of the carrier, so that the protrusions protruding from the plane surface of the wafer are embedded in the curable resin and a back surface of the carrier opposite to the front surface thereof is substantially parallel to the side of the wafer being opposite to the one side;
• and
• grinding the side of the wafer being opposite to the one side for adjusting the wafer thickness.