Lead frame and the method to fabricate thereof
AssigneeCyntec Co., Ltd.
InventorsChia Pei Chou, Lang-Yi Chiang, Jih-Hsu Yeh, You Chang Tseng
Life of this patent
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Abstract
A method to form an electrical component, the method comprising: providing a first lead and a second lead; forming a first conductive pillar and a second conductive pillar on a first portion of the top surface of the first lead and a first portion of the top surface of the second lead, respectively, wherein a second portion of the top surface of the first lead, a second portion of the top surface of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one device is disposed in said 3D space and electrically connected to the at least one device to the first conductive pillar and the second conductive pillar.
Claims20
A method to form an inductor, comprising:
- providing a first lead and a second lead of the inductor;
- and
- forming a first conductive pillar and a second conductive pillar on a first portion of the first lead and a first portion of the second lead, respectively, wherein a second portion of the first lead, a second portion of the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one portion of a coil comprising a plurality of winding turns is disposed in the 3D space with a bottom surface of the plurality of winding turns being respectively lower than a top surface of the first conductive pillar and a top surface of the second conductive pillar, and two terminal parts of the coil are electrically connected to the first lead and the second lead via the first conductive pillar and the second conductive pillar, respectively.
A method to form an inductor, comprising:
- providing a metallic substrate;
- and
- forming a first conductive pillar and a second conductive pillar on a first portion and a second portion of the metallic substrate, respectively, wherein a third portion of the metallic substrate, a fourth portion of the metallic substrate, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one portion of a coil comprising a plurality of winding turns is disposed in the 3D space with a bottom surface of the plurality of winding turns being respectively lower than a top surface of the first conductive pillar and a top surface of the second conductive pillar, and two terminal parts of the coil are electrically connected to the first portion and the second portion of the metallic substrate via the first conductive pillar and the second conductive pillar, respectively, wherein the first portion and the second portion of the metallic substrate are respectively used to form a first lead and a second lead of the inductor.
A method to form an inductor, comprising:
- providing a substrate, having a first portion, a second portion and a third portion between the first portion and the second portion;
- and
- forming a first conductive pillar and a second conductive pillar respectively on the first portion and the second portion of the substrate and to remove the third portion of the substrate such that the first portion and the second portion of the substrate respectively define a first lead and a second lead of the inductor;
- wherein the first lead, the second lead, the first conductive pillar, and the second conductive pillar form a 3D space, wherein at least one portion of a coil comprising a plurality of winding turns is disposed in the 3D space with a bottom surface of the plurality of winding turns being respectively lower than a top surface of the first conductive pillar and a top surface of the second conductive pillar, and two terminal parts of the coil are electrically connected to the first lead and the second lead via the first conductive pillar and the second conductive pillar, respectively.
Dependencies are inferred from the claim text.