Chemical mechanical polishing automated recipe generation

A computer-readable storage medium storing a program, which, when executed by a processor performs an operation for polishing a substrate, the operation comprising:

• premeasuring thickness at selected locations on the substrate at a metrology station, each location corresponding to a location of a single die;
• providing the thicknesses obtained using the metrology station for the selected locations of the substrate to a controller of a polishing module;
• determining thickness corrections for each selected location on the substrate;
• forming a step in a polishing recipe from the thickness corrections for each selected location;
• and
• calculating a polishing parameter for each selected location.

A system, comprising:

• a processor;
• and
• a memory, wherein the memory includes an application program configured to perform an operation for generating polishing recipes, comprising:
• premeasuring thickness at selected locations on the substrate at a metrology station, each location corresponding to a location of a single die;
• providing the thicknesses obtained using the metrology station for the selected locations of the substrate to a controller of a polishing module;
• determining thickness corrections for each selected location on the substrate;
• forming a step in a polishing recipe from the thickness corrections for each selected location;
• and
• calculating a polishing parameter for each selected location.