Charged particle beam writing method
AssigneeNuFlare Technology, Inc.
InventorHirohito Anze
Life of this patent
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AssigneeNuFlare Technology, Inc.
InventorHirohito Anze
Estimating the term…
In one embodiment, a charged particle beam writing method includes writing a first pattern statically in central part of a first substrate having Charge Dissipation Layer (CDL), calculating, based on a position of the written first pattern, a first correction coefficient, writing a second pattern statically applying with the first correction coefficient in central part of a second substrate having no CDL, calculating, based on a position of the written second pattern, a second correction coefficient, writing a third pattern continuously applying with the first correction coefficient in central part of a third substrate having CDL, calculating, based on a position of the written third pattern, a third correction coefficient, writing a fourth pattern statically applying with the first correction coefficient in wide range of a fourth substrate having CDL, and calculating, based on a position of the written fourth pattern, a fourth correction coefficient.
A charged particle beam writing method for writing a pattern on a substrate by irradiating the substrate with a charged particle beam, the substrate being placed on a movable stage and coated with resist, the method comprising:
A charged particle beam writing method for writing a pattern on a substrate placed on a movable stage and coated with resist by irradiating the substrate with a charged particle beam, the method comprising:
Dependencies are inferred from the claim text.