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US 10,256,039 B2Granted
Coil electronic component and method for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYou Na Kim, Moon Soo Park, Min Hee Kim, Jong Ho Lee
Life of this patent
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Abstract
A coil electronic component includes: a coil part; an insulating layer covering the coil part; a magnetic body enclosing the coil part covered by the insulating layer; and an adhesive layer disposed between the insulating layer and the magnetic body to prevent chipping of the magnetic body.
Claims5
A coil electronic component comprising:
- a substrate, including a through hole in a central portion of the substrate;
- a coil part on the substrate;
- an insulating layer covering the coil part;
- an adhesive layer covering the insulating layer
- a magnetic body enclosing the coil part, the insulating layer, and the adhesive layer, and in the through hole of the substrate, comprising a magnetic metal powder and a thermosetting resin,
- wherein a distance between an upper surface of the adhesive layer disposed on the coil part and the substrate is greater than a distance between an upper surface of the adhesive layer not disposed on the coil part and the substrate.
3 more elements
Dependencies are inferred from the claim text.