Electronic component and method for manufacturing the same

An electronic component comprising:

• a multilayer body having a configuration, in which a plurality of insulator layers containing ferrite ceramic are stacked in a stacking direction;
• and
• a coil having a configuration, in which a plurality of coil conductor layers containing Ag and being disposed on the insulator layers are connected to at least one via hole conductor penetrating the insulator layer in the stacking direction, and having a spiral shape spiraling in the stacking direction,
• wherein a first pore area ratio of a side gap interposed between an outer circumferential edge of an annular track formed by stacking the plurality of coil conductor layers and an outer edge of the multilayer body, when viewed in the stacking direction, is 9.0% or more and 20.0% or less, and
• a second pore area ratio of a portion interposed between two coil conductor layers in the stacking direction is 8.0% or less, wherein
• the coil conductor layer is formed by an electrically conductive paste containing a metal oxide such that the metal oxide is present inside of the coil conductor.