Multi channel semiconductor device having multi dies and operation method thereof

A communication system comprising:

• an application processor;
• and
• a semiconductor device comprising:
• a package substrate;
• a first die and a second die disposed on the package substrate respectively, the first die having a first channel and a first pad configured to receive a first control signal for controlling the first die, and the second die having a second channel and a second pad configured to receive the first control signal for controlling the second die, the first control signal being received either by the first die or by the second die, wherein, when the first control signal is received by the first die, a first control information is generated in the first die based on the received first control signal, and when the first control signal is received by the second die, the first control information is generated in the second die;
• and
• a first internal interface connecting the first and second dies, wherein, when the first control information is generated in the first die, the first control information is transmitted to the second die through the first internal interface for controlling the second die, and, when the first control information is generated in the second die, the first control information is transmitted to the first die through the first internal interface for controlling the first die,
• wherein the application processor communicates with at least one of the first and second channels of the semiconductor device, and the first and second dies are disposed horizontally adjacent to and in mirror symmetry in relation to each other on the package substrate.

A method of controlling a first and second die of a semiconductor package, the first and second die disposed on a package substrate of the semiconductor package and horizontally adjacent each other, the method including:

• receiving a first ZQ signal at the first die, the first ZQ signal directing a first ZQ calibration operation to start;
• in response to the first ZQ signal, performing the first ZQ calibration operation with respect to the first die;
• transmitting the first ZQ signal from the first die to the second die;
• and
• based on the transmitted first ZQ signal, after performing of the first ZQ calibration operation with respect to the first die is complete, performing a first ZQ calibration operation with respect to the second die.