Touch module and manufacturing method thereof

A manufacturing method of a touch module, the manufacturing method comprising:

• forming at least one bridge on a substrate;
• providing at least one isolating layer on the bridge;
• forming an active layer overlaying the bridge, the isolating layer, and the substrate;
• forming a first conductive material layer on a top surface of the active layer;
• and
• embedding a portion of the first conductive material layer into the active layer to space the portion of the first conductive material layer apart from the top surface of the active layer upon which the portion of the first conductive material layer was formed, wherein:
• the portion of the first conductive material layer defines at least two first touch electrodes, at least two second touch electrodes, and at least one electrode channel,
• embedding the portion of the first conductive material layer into the active layer comprises:
• embedding a first embedding portion of the first conductive material layer into the active layer until the first touch electrodes and the second touch electrodes in the first embedding portion contact the substrate and the electrode channel in the first embedding portion contacts the isolating layer to separately form the first touch electrodes, the second touch electrodes, and the electrode channel, and make the first touch electrodes electrically contact the bridge;
• and
• retaining a first retention portion of the first conductive material layer on the top surface of the active layer, wherein the electrode channel is electrically isolated from the bridge by the isolating layer,
• the first touch electrodes are electrically contacted to the bridge and electrically connected to each other via the bridge, and
• the electrode channel is configured to allow the second touch electrodes to be electrically connected to each other.

A manufacturing method of a touch module, the manufacturing method comprising:

• forming at least one bridge on a substrate;
• forming an active layer overlaying the bridge and the substrate;
• forming a first conductive material layer on a top surface of the active layer;
• and
• embedding a portion of the first conductive material layer into the active layer to space the portion of the first conductive material layer apart from the top surface of the active layer upon which the portion of the first conductive material layer was formed, wherein:
• the portion of the first conductive material layer defines at least two first touch electrodes, at least two second touch electrodes, and at least one electrode channel,
• wherein embedding the portion of the first conductive material layer into the active layer comprises:
• embedding a first embedding portion of the first conductive material layer into the active layer to a height relative to the substrate, so as to form a second conductive material layer, and retaining a first retention portion of the first conductive material layer on the active layer, wherein the second conductive material layer is not electrically contacted to the bridge;
• and
• embedding a second embedding portion of the second conductive material layer into the active layer to form the first touch electrodes and make the first touch electrodes electrically contact the bridge, and retaining a second retention portion of the second conductive material layer in the active layer at the height relative to the substrate, wherein the second retention portion comprises the second touch electrodes and the electrode channel
• the first touch electrodes are electrically contacted to the bridge and electrically connected to each other via the bridge, and
• the electrode channel is configured to allow the second touch electrodes to be electrically connected to each other.