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US 10,254,876 B2Granted
Array substrate, fabricating method thereof and display device
AssigneesBoe Technology Group Co., Ltd., Chengdu Boe Optoelectronics Technology Co., Ltd.
InventorsYouqiang Lu, Xiaojing Qi, Zhidong Wang, Jing Wang
Life of this patent
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Abstract
An array substrate, a fabricating method thereof and a display device, the fabricating method comprises forming a plurality of touch electrodes on a base substrate, a plurality of touch electrode leads for leading out signals of the touch electrodes and an array structure comprising a plurality of conducting structures. At least part of touch electrode leads and at least one of the conducting structures are disposed in a same layer and made from a same material. The fabricating method can reduce the amount of masks used in the fabricating process of the array substrate.
Claims16
An array substrate comprising:
- a base substrate;
- a plurality of touch electrodes disposed on the base substrate;
- a plurality of touch electrode leads disposed on the base substrate and configured for leading out signals of the touch electrodes respectively;
- and
- an array structure disposed on the base substrate comprising a plurality of conducting structures;
- wherein
- at least part of each touch electrode lead and at least one of the conducting structures are disposed in a same layer and are made from a same material, the array substrate further comprises a plurality of gate lines and a plurality of data lines which are disposed on the base substrate and are insulated from the touch electrode leads, each touch electrode lead comprises at least two first linear portions and at least one first bridging portion,
- wherein
- the at least two first linear portions and the gate lines are disposed in a same layer;
- the touch electrode lead intersects with at least one of the gate lines, and two adjacent first linear portions are connected through a first bridging portion at an intersection of the touch electrode lead with the gate line;
- or
- the at least two first linear portions and the data lines are disposed in a same layer;
- the touch electrode lead intersects with at least one of the data lines, and two adjacent first linear portions are connected through a first bridging portion at an intersection of the touch electrode lead with the data line.
10 more elements
An array substrate, comprising:
- a base substrate;
- a plurality of touch electrodes disposed on the base substrate;
- a plurality of touch electrode leads disposed on the base substrate and configured for leading out signals of the touch electrodes respectively;
- and
- an array structure disposed on the base substrate comprising a plurality of conducting structures;
- wherein
- at least part of each touch electrode lead and at least one of the conducting structures are disposed in a same layer and are made from a same material;
- each touch electrode lead comprises a linear portion and a bridging portion, and the bridging portion connects a touch electrode corresponding to the touch electrode lead to the linear portion;
- the array substrate further comprises a passivation layer on the base substrate;
- and in a direction perpendicular to the base substrate, the passivation layer is between the linear portion of the touch electrode lead and the touch electrode corresponding to the touch electrode lead;
- the array structure comprises a plurality of thin film transistors and a plurality of first electrodes connected with the plurality of thin film transistors respectively, and the plurality of conducting structures comprise the plurality of first electrodes;
- and
- the bridging portion and each of the plurality of first electrodes are disposed in a same layer and are made from a same material.
10 more elements
A fabricating method of an array substrate comprising:
- forming a plurality of touch electrodes on a base substrate;
- forming a plurality of touch electrode leads on the base substrate for leading out signals of the touch electrodes;
- and
- forming an array structure comprising a plurality of conducting structures on the base substrate;
- wherein
- at least part of each touch electrode lead and at least one of the conducting structures are formed in a same mask process;
- each touch electrode lead is insulated from gate lines and data lines, and each touch electrode lead intersects with at least one of the gate lines or data lines;
- each touch electrode lead comprises at least two first linear portion and at least one bridging portion,
- wherein
- the at least two first linear portions and the gate lines are disposed in a same layer;
- the touch electrode lead intersects with at least one of the gate lines, and two adjacent first linear portions are connected through a first bridging portion at an intersection of the touch electrode lead with the gate line, or
- the at least two first linear portions and the data lines are disposed in a same layer;
- the touch electrode lead intersects with at least one of the data lines, and two adjacent first linear portions are connected through a first bridging portion at an intersection of the touch electrode lead with the data line, or
- each touch electrode lead comprises a linear portion and a second bridging portion, and a touch electrode corresponding to the touch electrode lead and the linear portion are connected by the bridging portion.
11 more elements
Dependencies are inferred from the claim text.