Radiation-sensitive resin composition, resin film, and electronic device
AssigneeZeon Corporation
InventorHiroaki Shindo
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Abstract
A radiation-sensitive resin composition comprising a binder resin (A), quinone diazide-based photoacid generator (B), (meth)acrylate compound (C), and photopolymerization initiator (D) is provided. According to the present invention, it is possible to provide a radiation-sensitive resin composition which can give a resin film which exhibits a high adhesion to a substrate and is excellent in transparency, photosensitivity, and chemical resistance.
Claims10
A radiation-sensitive resin composition containing cyclic olefin polymer which has a protonic polar group (A1), quinone diazide-based photoacid generator (B), (meth)acrylate compound (C), and photopolymerization initiator (D), wherein
- a content of the quinone diazide-based photoacid generator (B) is 15 to 100 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer which has a protonic polar group (A1).
Dependencies are inferred from the claim text.