Liquid solder resist composition and printed wiring board

A liquid solder resist composition comprising:

• a carboxyl group-containing resin (A);
• a thermosetting component (B);
• a photopolymerizable component (C);
• and
• a photopolymerization initiator (D),
• the thermosetting component (B) containing an epoxy compound (B1),
• the epoxy compound (B1) containing a powdery epoxy compound (B11) represented by following formula (1) and an epoxy compound (B12) other than the epoxy compound (B11),
• R1, R2, R3, and R4 in the formula (1) being independently a methyl group, a hydrogen atom, or a t-butyl group,
• the epoxy compound (B11) having a melting point within a range of 138 to 145° C.,
• an amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) being within a range of 4.0 to 8.0 weight %, and
• an equivalent weight of epoxy groups in the epoxy compound (B1) with respect to 1 equivalent of carboxyl groups in the carboxyl group-containing resin (A) being within a range of 1.0 to 4.0 equivalent.