Display panel and method of fabricating the same

A method of manufacturing a display panel, comprising:

• providing a first substrate, wherein the first substrate has an active area and a peripheral area;
• forming a pixel unit and a connecting structure on the first substrate, wherein the pixel unit and the connecting structure are located in the active area and the peripheral area, respectively, the pixel unit comprises a thin film transistor (TFT), a pixel electrode and a common electrode, and the connecting structure is configured to electrically connect different metal layers, wherein forming the connecting structure comprises:
• forming a first metal layer on the first substrate;
• forming a first insulating layer on the first substrate and the first metal layer;
• forming a second metal layer on the first insulating layer;
• forming a second insulating layer on the first insulating layer and the second metal layer;
• forming a first through hole penetrating the first insulating layer and the second insulating layer, wherein the first through hole exposes the first metal layer;
• forming a second through hole penetrating the second insulating layer, wherein the second through hole exposes the second metal layer;
• and
• forming a conductive layer on the second insulating layer, wherein the conductive layer is electrically connected to the first metal layer and the second metal layer respectively through the first through hole and second through hole, wherein the conductive layer and one of the pixel electrode and the common electrode belong to a transparent conductive layer;
• forming a passivation layer on the connecting structure and the TFT, wherein the passivation layer covers the TFT and the conductive layer;
• providing a second substrate;
• and
• forming a sealant sandwiched between the first substrate and the second substrate, wherein the second substrate is disposed opposite to the first substrate;
• wherein a vertical projection of the sealant on the first substrate and a vertical projection of the connecting structure on the first substrate are overlapped.

A display panel, comprising:

• a first substrate having an active area and a peripheral area;
• a pixel unit located on the active area of the first substrate, wherein the pixel unit comprises a thin film transistor (TFT), a pixel electrode and a common electrode;
• a driving circuit disposed on the first substrate and located in the peripheral area, wherein the driving circuit comprises another TFT and a connecting structure, wherein the connecting structure is configured to electrically connect different metal layers, and the connecting structure comprises:
• a first metal layer disposed on the first substrate;
• a first insulating layer disposed on the first substrate and the first metal layer;
• a second metal layer disposed on the first insulating layer;
• a second insulating layer disposed on the first insulating layer and the second metal layer, wherein a combination of the first insulating layer and the second insulating layer comprises a first through hole, wherein the second insulating layer further comprises a second through hole, and wherein the first through hole and the second through hole expose the first metal layer and the second metal layer, respectively;
• and
• a conductive layer disposed on the second insulating layer, wherein the conductive layer is electrically connected to the first metal layer and the second metal layer respectively through the first through hole and second through hole;
• a passivation layer disposed on the connecting structure, wherein the passivation layer covers the conductive layer;
• a second substrate disposed opposite to the first substrate;
• and
• a sealant sandwiched between the first substrate and the second substrate, wherein the sealant at least partially covers the driving circuit in a direction perpendicular to the first substrate;
• wherein the TFT of the pixel unit and the another TFT of the driving circuit are made simultaneously by the same processes, a vertical projection of the sealant on the first substrate and a vertical projection of the connecting structure on the first substrate are overlapped, and the conductive layer and one of the pixel electrode and the common electrode belong to a transparent conductive layer.