Apparatus and methods for micro-transfer-printing

A method for assembling a semiconductor device on a receiving surface of a destination substrate by micro-transfer printing, the method comprising:

• providing the semiconductor device formed on a native substrate, wherein the semiconductor device has a relatively low coefficient of thermal expansion;
• contacting a top surface of the semiconductor device with a conformable transfer device comprising an elastomer stamp comprising a protruding post having a contact surface, wherein contact between the contact surface and the top surface of the semiconductor device at least temporarily binds the semiconductor device to the conformable transfer device, wherein the conformable transfer device has a relatively high coefficient of thermal expansion that is higher than the relatively low coefficient of thermal expansion of the semiconductor device;
• separating the semiconductor device from the native substrate such that the contact surface of the conformable transfer device has the semiconductor device disposed thereon with the semiconductor device released from the native substrate;
• contacting the semiconductor device disposed on the contact surface with the receiving surface of the destination substrate;
• heating the destination substrate and the conformable transfer device to cause the conformable transfer device to expand more than the semiconductor device;
• and
• separating the contact surface of the conformable transfer device from the semiconductor device, thereby micro-transfer printing the semiconductor device onto the receiving surface of the destination substrate.