# US 10,246,778 B2 · Electroless nickel plating solution and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,778 B2 - Document ID: US10246778B2 - Status: Granted - Kind: B2 - Application number: 13/961,018 - Filed: 2013-08-07 - Published: 2015-02-12 - Granted: 2019-04-02 - Earliest claimed: 2013-08-07 - Assignees: MacDermid Acumen, Inc. - Applicants: MacDermid Acumen, Inc. - Inventors: Robert Janik; Nicole J. Micyus - Web page: https://patentgrep.com/patent/US10246778B2 ## CPC - C23C 18/1646: {Characteristics of the product obtained} - C23C 18/1637: {metallic substrate} - C23C 18/1639: {Substrates other than metallic, e.g. inorganic or organic or non-conductive} - C23C 18/1641: {Organic substrates, e.g. resin, plastic} - C23C 18/1824: {by chemical pretreatment} - C23C 18/1844: {with use of organic or inorganic compounds other than metals, first} - C23C 18/1893: {with use of organic or inorganic compounds other than metals, first} - C23C 18/2046: {by chemical pretreatment} - C23C 18/2086: {with use of organic or inorganic compounds other than metals, first} - C23C 18/34: using reducing agents - C23C 18/36: using hypophosphites - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) ## Abstract An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value. ## Claims ### Claim 1 A process of plating a substrate to provide a bright electroless nickel deposit thereon, the method comprising the steps of: a) preparing a substrate to accept electroless nickel plating thereon; and b) plating the substrate with an electroless nickel plating solution, the electroless nickel plating solution comprising; 1) a source of nickel ions; 2) a reducing agent; 3) one or more complexing agents; 4) one or more bath stabilizers, said one or more bath stabilizers comprising a source of bismuth ions; and 5) a brightener selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates; wherein the concentration of the brightener in the electroless nickel plating solution is in the range of about 0.1-3.0 mg/l; and wherein the deposited electroless nickel layer has a measured gloss unit value above about 120. ### Claim 2 (depends on 1) The process according to claim 1, wherein the brightener is selected from the group consisting of 2-amino ethane sulfonic acid, toluene sulfonamide, 1-octane sulfonic acid, 2-chloro-hydroxy-propane sulfonic acid, saccharin, sodium diamyl sulfosuccinate, sodium 1,4,-bis(1,3-dimethylbutyl) sulfosuccinate, sulfosuccinic acid, and sodium allyl sulfonate. ### Claim 3 (depends on 2) The process according to claim 2, wherein the brightener is 2-amino ethane sulfonic acid. ### Claim 4 (depends on 1) The process according to claim 1, wherein the brightener is substantially the only brightener in the electroless nickel plating solution. ### Claim 5 (depends on 1) The process according to claim 1, wherein the deposited electroless nickel layer has a measured gloss unit value above about 170. ### Claim 6 (depends on 5) The process according to claim 5, wherein the deposited electroless nickel layer has a measured gloss unit value above about 200. ### Claim 7 (depends on 1) The process according to claim 1, wherein the substrate is a metal substrate selected from the group consisting of steel, aluminum, copper, zinc and brass. ### Claim 8 (depends on 7) The process according to claim 7, wherein the substrate is steel. ### Claim 9 (depends on 1) The process according to claim 1, wherein the substrate is a non-conductive substrate selected from the group consisting of plastics and ceramics. ### Claim 10 (depends on 1) The process according to claim 1, wherein the one or more complexing agents are selected from the group consisting of carboxylic acids, polyamines or sulfonic acids, or mixtures thereof. ### Claim 11 (depends on 10) The process according to claim 10, wherein the concentration of the one or more complexing agents is about 15 to about 75 g/L. ### Claim 12 (depends on 11) The process according to claim 11, wherein the concentration of the one or more complexing agents is about 20 to about 40 g/L. ### Claim 13 (depends on 1) The process according to claim 1, wherein the step of preparing a substrate to accept electroless nickel plating thereon involves one or more of the following: 1) cleaning the substrate; 2) activating the substrate; or 3) microetching the substrate. ### Claim 14 (depends on 1) The process according to claim 1, wherein the concentration of the brightener in the electroless nickel plating solution is in the range of about 0.5-2.0 mg/L. ### Claim 15 (depends on 14) The process according to claim 14, wherein the concentration of the brightener in the electroless nickel plating solution is about 0.8 mg/L. ### Claim 16 (depends on 1) The process according to claim 1, wherein the electroless nickel plating solution further comprises 2-aminothiazole. ### Claim 17 A process of plating a substrate to provide a bright electroless nickel deposit thereon, the method comprising the steps of: a) preparing a substrate to accept electroless nickel plating thereon; and b) plating the substrate with an electroless nickel plating solution, the electroless nickel plating solution comprising; 1) a source of nickel ions; 2) a reducing agent; 3) one or more complexing agents, the one or more complexing agents in a concentration of about 15 to about 75 g/L; 4) one or more bath stabilizers, the one or more bath stabilizers comprising a source of bismuth ions; 5) a brightener selected from the group consisting of alkyl or aryl substituted sulfonamides, alkyl or aryl substituted sulfonic acids, alkyl or aryl substituted sulfosuccinates, and alkyl or aryl substituted sulfonates, the sulfonated compound in a concentration of about 0.1-3.0 mg/L; and 6) 2-aminothiazole; wherein the deposited electroless nickel layer has a measured gloss unit value above about 170.