# US 10,246,636 B1 · LED device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,636 B1 - Document ID: US10246636B1 - Status: Granted - Kind: B1 - Application number: 15/886,801 - Filed: 2018-02-01 - Granted: 2019-04-02 - Earliest claimed: 2018-01-16 - Assignees: Leedarson Lighting Co., Ltd. - Applicants: Leedarson Lighting Co. Ltd. - Inventors: Yanbiao Chen; Liangliang Cao; Huiwu Chen; Qiyuan Wang - Web page: https://patentgrep.com/patent/US10246636B1 ## CPC - C09K 11/0883: {Arsenides; Nitrides; Phosphides} - C08K 3/34: Silicon-containing compounds - C09K 11/59: containing silicon - F21K 9/64: using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer - H10H 20/8506: {Containers} - H10H 20/851: Wavelength conversion means - H10H 20/8513: {having two or more wavelength conversion materials} - H10H 20/852: Encapsulations - H10H 20/0361: {of wavelength conversion means} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10W 90/00: Package configurations - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A LED device includes LED chips mounted on a substrate, a first fluorescent layer, a second fluorescent layer and a package housing. The LED chips emit a blue light. The first fluorescent layer has a first side facing to the LED chips for converting the blue light to a red light. The second fluorescent layer has a first side attached to a second side of the first fluorescent layer for converting the blue light to a red light emitted from a second side of the second fluorescent layer. The package housing holds the substrate and the first fluorescent layer. ## Claims ### Claim 1 A LED device, comprising: a LED module mounted on a substrate for emitting a blue light; a first fluorescent layer with a first side facing to the LED module for converting the blue light to a red light; a second fluorescent layer having a first side attached to a second side of the first fluorescent layer for converting the blue light to a green light emitted from a second side of the second fluorescent layer; and a package housing for holding the substrate and the first fluorescent layer, wherein the package housing has a ladder wall for engaging with a peripheral part of the second fluorescent layer. ### Claim 2 (depends on 1) The LED device of claim 1, wherein the LED module has multiple LED chips emitting the blue light, the substrate has a first terminal area and a second terminal area for mounting the multiple LED chips, the first terminal area and the second terminal area are provided for respectively connected to a positive terminal and a negative terminal of a power source. ### Claim 3 (depends on 1) The LED device of claim 1, wherein the first fluorescent comprises red phosphor material contained in first silicone part, the second fluorescent layer comprises green phosphor material contained in a second silicone part, and wherein a part of the green light excites the red phosphor if the green light hits the red phosphor. ### Claim 4 (depends on 3) The LED device of claim 3, wherein a first volume ratio of the red phosphor to the first silicone part is larger than a second volume ratio of the green phosphor to the second silicone part. ### Claim 5 (depends on 3) The LED device of claim 3, wherein a first volume ratio of the red phosphor to the first silicone part is smaller than a second volume ratio of the green phosphor to the second silicone part. ### Claim 6 (depends on 1) The LED device of claim 1, wherein a thickness of the first fluorescent layer is larger than a thickness of the second fluorescent layer. ### Claim 7 (depends on 1) The LED device of claim 1, wherein a thickness of the first fluorescent layer is smaller than a thickness of the second fluorescent layer. ### Claim 8 (depends on 1) The LED device of claim 1, wherein the first fluorescent layer has better heat resisting feature than the second fluorescent layer. ### Claim 9 (depends on 1) The LED device of claim 1, wherein the package housing has a bottom part fixed to the substrate and the package housing has a surrounding wall extended from the bottom part, the wall defines a containing space for holding the first fluorescent layer. ### Claim 10 (depends on 9) The LED device of claim 9, wherein a second side of the second fluorescent layer has a curved surface. ### Claim 11 (depends on 10) The LED device of claim 10, wherein an angle of edges of the first side and the second side of the second fluorescent layer is less than 60 degrees. ### Claim 12 (depends on 10) The LED device of claim 10, wherein the curve surface forms a convex lens. ### Claim 13 (depends on 1) The LED device of claim 1, wherein area of the second side of the second fluorescent layer is smaller than area of the second side of the first fluorescent layer. ### Claim 14 (depends on 13) The LED device of claim 13, wherein a part of the second side of the first fluorescent layer is exposed and uncovered by the second fluorescent layer. ### Claim 15 (depends on 14) The LED device of claim 14, wherein the second side of second fluorescent layer is surrounded by the second side of the first fluorescent layer from a top view. ### Claim 16 (depends on 1) The LED device of claim 1, wherein the second side of the second fluorescent layer forms a flat surface. ### Claim 17 (depends on 1) The LED device of claim 1, wherein the second side of second florescent layer forms a curve surface. ### Claim 18 (depends on 1) The LED device of claim 1, wherein the second side of the second fluorescent layer has multiple convex part corresponding to multiple underlying LED chips of the LED module. ### Claim 19 (depends on 1) The LED device of claim 1, wherein the LED module is mounted on the substrate with surface mount device (SMD) technology.