# US 10,246,623 B2 · Resin composition, article prepared by using the same, and method of preparing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,623 B2 - Document ID: US10246623B2 - Status: Granted - Kind: B2 - Application number: 15/272,882 - Filed: 2016-09-22 - Published: 2018-03-22 - Granted: 2019-04-02 - Earliest claimed: 2016-09-21 - Assignees: Naieel Technology - Applicants: NAiEEL Technology - Inventors: Jaewoo Kim; Duck Bong Seo; Chan Kyu Kwak - Web page: https://patentgrep.com/patent/US10246623B2 ## CPC - C09K 5/14: Solid materials, e.g. powdery or granular - C08K 3/38: Boron-containing compounds - C08K 2003/385: {Binary compounds of nitrogen with boron} - C08K 2201/001: Conductive additives - C08K 2201/011: Nanostructured additives - C09K: MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract Provided are a resin composition, an article prepared by using the resin composition, and a method of preparing the article. The resin composition includes thermally conductive particles, boron nitride nanotubes, and a matrix resin. ## Claims ### Claim 1 A resin composition comprising: thermally conductive particles; boron nitride nanotubes, wherein the boron nitride nanotubes are at an amount in a range of about 1.5 wt % to not more than 4.5 wt % based on a total weight of the thermally conductive particles; and a matrix resin. ### Claim 2 (depends on 1) The resin composition of claim 1, wherein an average particle diameter of the thermally conductive particles is in a range of about 0.1 μm to about 150 μm, and an average aspect ratio of the thermally conductive particles is in a range of about 1 to about 300. ### Claim 3 (depends on 1) The resin composition of claim 1, wherein the thermally conductive particles comprise a metal nitride, a metal oxide, a metal oxynitride, a metal carbide, or a combination thereof. ### Claim 4 (depends on 1) The resin composition of claim 1, wherein the thermally conductive particles comprise an aluminum nitride, an aluminum oxide, an aluminum oxynitride, a boron nitride, a boron oxide, a boron oxynitride, a silicon oxide, silicon carbide, a beryllium oxide, or a combination thereof. ### Claim 5 (depends on 1) The resin composition of claim 1, wherein the thermally conductive particles comprise a boron nitride. ### Claim 6 (depends on 1) The resin composition of claim 1, wherein the thermally conductive particles are hexagonal boron nitride particles. ### Claim 7 (depends on 5) The resin composition of claim 5, wherein an average particle diameter of the hexagonal boron nitride particles is in a range of about 0.1 μm to about 150 μm, and an average aspect ratio of the hexagonal boron nitride particles is in a range of about 10 to about 300. ### Claim 8 (depends on 1) The resin composition of claim 1, wherein an average diameter of the boron nitride nanotubes is in a range of about 2 nm to about 1 μm, an average length of the boron nitride nanotubes is in a range of about 0.5 μm to about 1,000 μm, and an average aspect ratio of the boron nitride nanotubes is in a range of about 5 to about 100,000. ### Claim 9 (depends on 1) The resin composition of claim 1, wherein the matrix resin is a thermoplastic resin or a thermosetting resin. ### Claim 10 (depends on 1) The resin composition of claim 1, wherein the matrix resin is at least one selected from a nylon resin, a polyethylene resin, a polypropylene resin, a polybutylene resin, a polyester resin, a polyurethane resin, a polyacrylic resin, a styrene butadiene resin, a vinyl resin, a polycarbonate resin, a polysulfone resin, a polyether sulfone resin, a polyvinylbutyral resin, a polyvinyl formal resin, a polyvinyl acetate resin, a polystyrene resin, a styrene divinylbenzene resin, a fluoride resin, an acrylic resin, a silicon resin, an epoxy resin, an amino resin, and a phenolic resin. ### Claim 11 (depends on 1) The resin composition of claim 1, wherein the matrix resin is an epoxy resin. ### Claim 12 (depends on 1) The resin composition of claim 1 comprising, based on a total weight of the resin composition: the thermally conductive particles at an amount in a range of about 10 or greater wt % to about 80 wt % or less; the boron nitride nanotubes at an amount in a range of greater than about 0 wt % to about 30 wt % or less; and the matrix resin at an amount in a range of about 20 wt % to about 90 wt %. ### Claim 13 (depends on 1) The resin composition of claim 1 further comprising an additive. ### Claim 14 (depends on 1) An article prepared by using the resin composition of claim 1. ### Claim 15 (depends on 14) The article of claim 14, wherein a thermal conductivity of the article is 3.0 W/mK or higher; a breakdown voltage of the article is 10.0 kV/mm or higher; and a flexural modulus of the article is 20 GPa or higher. ### Claim 16 A method of preparing an article, the method comprising providing a resin composition comprising thermally conductive particles, boron nitride nanotubes, and a matrix resin, wherein the boron nitride nanotubes are at an amount in a range of about 1.5 wt % not more than 4.5 wt % based on a total weight of the thermally conductive particles; and heating or curing the resin composition to form an article. ### Claim 17 (depends on 16) The method of claim 16 further comprising pre-treating the thermally conductive particles and/or the boron nitride nanotubes before the providing of the resin composition, wherein the pre-treating comprises: dispersing the thermally conductive particles and/or the boron nitride nanotubes in a solvent to prepare a dispersion; applying ultrasonic waves to the dispersion; and removing the solvent. ### Claim 18 (depends on 1) The resin composition of claim 1, wherein the boron nitride nanotubes are at an amount of about 3 wt % based on a total weight of the thermally conductive particles.