# US 10,246,613 B2 · Light-reflective anisotropic conductive adhesive and light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,613 B2 - Document ID: US10246613B2 - Status: Granted - Kind: B2 - Application number: 14/402,035 - Filed: 2013-06-11 - Published: 2015-06-18 - Granted: 2019-04-02 - Earliest claimed: 2012-06-15 - Assignees: Dexerials Corporation - Applicants: Dexerials Corporation - Inventors: Keisuke Morita; Tomoyasu Sunaga - Web page: https://patentgrep.com/patent/US10246613B2 ## CPC - C09J 9/02: Electrically-conducting adhesives - C09J 183/08: containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen - H01B 1/22: the conductive material comprising metals or alloys - H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads} - H10H 20/841: Reflective coatings, e.g. dielectric Bragg reflectors - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 72/30: Die-attach connectors - C08G 77/388: containing nitrogen - C08K 9/10: Encapsulated ingredients - C08K 2201/001: Conductive additives - H05K 2201/10106: Light emitting diode [LED] - H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics - H10W 72/5522: {comprising gold [Au]} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) - H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K}) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract A light-reflective anisotropic conductive adhesive used for anisotropic conductive connection of a light-emitting element to a wiring substrate includes a thermosetting resin composition, conductive particles, and light-reflective insulating particles. The thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1), and a curing agent for an epoxy resin. ## Claims ### Claim 1 A light-reflective anisotropic conductive adhesive used for an electrically anisotropic conductive connection of a light-emitting element to a wiring substrate, the light-reflective anisotropic conductive adhesive comprising a thermosetting resin composition, conductive particles, a curing agent for an epoxy resin, and light-reflective insulating particles, wherein the curing agent for an epoxy resin is an acid anhydride-based curing agent, and the thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1) wherein in the formula, R represents an alkyl group or an aryl group, and n represents an integer of 1 to 40. ### Claim 2 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein R is a methyl group. ### Claim 3 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the thermosetting resin composition includes 50 to 120 parts by mass of the curing agent for an epoxy resin relative to 100 parts by mass of the diglycidyl isocyanuryl modified polysiloxane of the formula (1). ### Claim 4 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the thermosetting resin composition further includes an imidazole-based curing accelerator. ### Claim 5 (depends on 4) The light-reflective anisotropic conductive adhesive according to claim 4, wherein the thermosetting resin composition includes 0.20 to 2.00 parts by mass of the imidazole-based curing accelerator relative to 100 parts by mass of the acid anhydride-based curing agent. ### Claim 6 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the light-reflective insulating particles are at least one kind of inorganic particles selected from the group consisting of titanium oxide particles, boron nitride particles, zinc oxide particles, and aluminum oxide particles. ### Claim 7 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the light-reflective insulating particles have a refractive index (JIS K7142) higher than a refractive index (JIS K7142) of a cured product of the thermosetting resin composition. ### Claim 8 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the light-reflective insulating particles are resin-coated metal particles in which a surface of flaky or spherical metal particles is coated with an insulating resin. ### Claim 9 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, comprising 1 to 50% by volume of the light-reflective insulating particles. ### Claim 10 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the conductive particles are light-reflective conductive particles each having a core particle coated with a metal material and a light-reflective layer formed from at least one kind of inorganic particles selected from titanium oxide particles, boron nitride particles, zinc oxide particles, and aluminum oxide particles on the surface of the core particle. ### Claim 11 (depends on 10) The light-reflective anisotropic conductive adhesive according to claim 10, wherein a mixing amount of the light-reflective conductive particles is 1 to 100 parts by mass relative to 100 parts by mass of the thermosetting resin composition. ### Claim 12 (depends on 1) A light-emitting device produced by flip-chip mounting a light-emitting element on a wiring substrate with the light-reflective anisotropic conductive adhesive according to claim 1 interposed therebetween. ### Claim 13 (depends on 12) The light-emitting device according to claim 12, wherein the light emitting element is a light-emitting diode. ### Claim 14 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, comprising 5 to 25% by volume of the light-reflective insulating particles. ### Claim 15 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein n represents 2. ### Claim 16 (depends on 1) The light-reflective anisotropic conductive adhesive according to claim 1, wherein the diglycidyl isocyanuryl modified polysiloxane is represented by the formula (1a): ### Claim 17 A light-reflective anisotropic conductive adhesive used for an electrically anisotropic conductive connection of a light-emitting element to a wiring substrate, the light-reflective anisotropic conductive adhesive comprising a thermosetting resin composition, conductive particles, a curing agent for an epoxy resin, and light-reflective insulating particles, wherein the curing agent for an epoxy resin is an imidazole-based curing agent, and the thermosetting resin composition includes a diglycidyl isocyanuryl modified polysiloxane represented by the formula (1) wherein in the formula, R represents an alkyl group or an aryl group, and n represents an integer of 1 to 40.