# US 10,246,588 B1 · Solvent-free resin composition and uses of the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,588 B1 - Document ID: US10246588B1 - Status: Granted - Kind: B1 - Application number: 15/819,382 - Filed: 2017-11-21 - Published: 2019-03-21 - Granted: 2019-04-02 - Earliest claimed: 2017-09-18 - Assignees: Taiwan Union Technology Corporation - Applicants: Taiwan Union Technology Corporation - Inventors: Shur-Fen Liu; Chin-Hsien Hung - Web page: https://patentgrep.com/patent/US10246588B1 ## CPC - C08L 79/04: Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors - C08G 59/5073: {having two nitrogen atoms in the ring} - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - H05K 1/0373: {containing additives, e.g. fillers (H05K1/036 takes precedence)} - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 3/0094: {Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement} - C08L 2203/206: use in coating or encapsulating of electronic parts - H05K 1/024: {Dielectric details, e.g. changing the dielectric material around a transmission line} - H05K 1/0346: {containing N} - H05K 2201/012: Flame-retardant; Preventing of inflammation - H05K 2201/0209: Inorganic, non-metallic particles - H05K 2201/0959: Plated through-holes or plated blind vias filled with insulating material - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A solvent-free thermosetting filling resin composition is provided. The resin composition comprises the following components: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein, A, B, R, and n in formula (I) are as defined in the specification. ## Claims ### Claim 1 A solvent-free resin composition, comprising: (A) a benzoxazine resin of formula (I), (B) an epoxy resin with an alicyclic skeleton; (C) an epoxy resin hardener; (D) a benzoxazine resin hardener; and (E) a modified filler, wherein in formula (I), A is a C24-C48 divalent hydrocarbon group with one or more aliphatic side chains; B is a covalent bond, or a C1-C13 divalent hydrocarbon group; R is H or a C1-C15 alkyl; and n is an integer of 0 to 100. ### Claim 2 (depends on 1) The resin composition of claim 1, wherein n is an integer of 0 to 50. ### Claim 3 (depends on 2) The resin composition of claim 2, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 1:9 to about 9:1. ### Claim 4 (depends on 3) The resin composition of claim 3, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 3:7 to about 7:3. ### Claim 5 (depends on 1) The resin composition of claim 1, wherein the epoxy resin (B) with an alicyclic skeleton does not contain a glycidyl ether group. ### Claim 6 (depends on 5) The resin composition of claim 5, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 1:9 to about 9:1. ### Claim 7 (depends on 6) The resin composition of claim 6, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 3:7 to about 7:3. ### Claim 8 (depends on 1) The resin composition of claim 1, wherein the epoxy resin (B) with an alicyclic skeleton has an ester group or an ether group as a connecting group. ### Claim 9 (depends on 1) The resin composition of claim 1, wherein the epoxy resin hardener (C) is selected from the group consisting of imidazole, imidazole derivatives, salts of imidazole, salts of imidazole derivatives, and combinations thereof. ### Claim 10 (depends on 1) The resin composition of claim 1, wherein the benzoxazine resin hardener (D) is selected from the group consisting of thiodipropionic acid, phenols, thiodiphenol benzoxazine, sulfonyl benzoxazine, sulfonyldiphenol, and combinations thereof. ### Claim 11 (depends on 1) The resin composition of claim 1, wherein the modified filler (E) is selected from the group consisting of modified silica, modified barium sulfate, modified calcium carbonate, modified silicon nitride, modified aluminum nitride, modified boron nitride, modified aluminum oxide, modified magnesium oxide, modified aluminum hydroxide, modified magnesium hydroxide, modified titanium oxide, modified mica, modified talc, modified organic bentonite, modified kaolin, modified Sillitin, modified silicon, and combinations thereof. ### Claim 12 (depends on 11) The resin composition of claim 11, wherein the modified filler (E) is modified silica. ### Claim 13 (depends on 1) The resin composition of claim 1, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 1:9 to about 9:1. ### Claim 14 (depends on 13) The resin composition of claim 13, wherein the weight ratio of the benzoxazine resin (A) to the epoxy resin (B) with an alicyclic skeleton is about 3:7 to about 7:3. ### Claim 15 (depends on 1) The resin composition of claim 1, wherein the amount of the epoxy resin hardener (C) is about 0.1 parts by weight to about 20 parts by weight per 100 parts by weight of the epoxy resin (B) with an alicyclic skeleton. ### Claim 16 (depends on 1) The resin composition of claim 1, wherein the amount of the benzoxazine resin hardener (D) is about 0.1 parts by weight to about 20 parts by weight per 100 parts by weight of the benzoxazine resin (A). ### Claim 17 (depends on 1) The resin composition of claim 1, wherein the amount of the modified filler (E) is about 35 wt % to about 80 wt % based on the total weight of the resin composition. ### Claim 18 (depends on 1) The resin composition of claim 1, further comprising an additive selected from the group consisting of flame retardants, colorants, viscosity modifiers, thixotropic agents, defoaming agents, leveling agents, coupling agents, mold-release agents, surface treating agents, plasticizers, antibacterial agents, antimould agents, stabilizers, antioxidants, phosphors, and combinations thereof. ### Claim 19 (depends on 18) The resin composition of claim 18, wherein the flame retardant is selected from the group consisting of phosphorous-containing flame retardants, bromine-containing flame retardants, and combinations thereof. ### Claim 20 (depends on 1) A printed circuit board, which has holes filled by using the resin composition of claim 1.