# US 10,246,550 B2 · Resin composition > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,550 B2 - Document ID: US10246550B2 - Status: Granted - Kind: B2 - Application number: 15/556,978 - Filed: 2016-03-10 - Published: 2018-02-22 - Granted: 2019-04-02 - Earliest claimed: 2015-03-12 - Assignees: Namics Corporation - Applicants: NAMICS Corporation - Inventors: Kazuki Iwaya; Fuminori Arai; Akikazu Matsuda; Naoto Okumura; Takeshi Kumano - Web page: https://patentgrep.com/patent/US10246550B2 ## CPC - C08G 59/66: Mercaptans - C08G 59/686: {containing nitrogen} - C08K 3/013: Fillers, pigments or reinforcing additives - C08K 3/014: Stabilisers against oxidation, heat, light or ozone - C08K 3/34: Silicon-containing compounds - C08K 3/36: Silica - C08K 5/005: {Stabilisers against oxidation, heat, light, ozone} - C08K 5/0091: {Complexes with metal-heteroatom-bonds} - C08K 5/16: Nitrogen-containing compounds {(C08K5/0091 takes precedence)} - C08K 5/37: Thiols - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C09J 163/00: Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins - C08K 3/38: Boron-containing compounds - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H) ## Abstract There is provided a resin composition which can be thermoset at a temperature of approximately 80° C., and has excellent PCT resistance and a long pot life. This resin composition is suitable as a one-component adhesive agent to be used during the manufacture of image sensor modules or electronic components. The resin composition according to the present invention is a resin composition having the following characteristics. The resin composition includes (A) a compound represented by formula (1) below, an oligomer having as its basic skeleton a structure represented by formula (2) below, (C) an epoxy resin, and (D) a curing accelerator. The mass ratio ((B)/(A)) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%. Furthermore, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the (C) component. In addition, the chloride ion concentration in the resin composition is 230 ppm or less. ## Claims ### Claim 1 A resin composition comprising: (A) a compound represented by formula (1) below; (B) an oligomer having as its basic skeleton a structure represented by formula (2) below; (C) an epoxy resin; and (D) a curing accelerator, wherein the mass ratio ((B)/(A)×100) between the compound of the (A) component and the oligomer of the (B) component is 5 to 25%, the total content of the compound of the (A) component and the oligomer of the (B) component is 0.5 equivalents to 2.5 equivalents in terms of the ratio of the thiol equivalent of the compound of the (A) component and the oligomer of the (B) component with respect to the epoxy equivalent of the epoxy resin of the (C) component, and a chloride ion concentration in the resin composition is 230 ppm or less. ### Claim 2 (depends on 1) The resin composition according to claim 1, wherein the curing accelerator of the (C) component is an imidazole curing accelerator or a tertiary amine compound. ### Claim 3 (depends on 1) The resin composition according to claim 1, further comprising (E) a filler. ### Claim 4 (depends on 3) The resin composition according to claim 3, wherein the filler of the (E) component is a silica filler or a talc filler. ### Claim 5 (depends on 1) The resin composition according to claim 1, further comprising (F) a stabilizer. ### Claim 6 (depends on 5) The resin composition according to claim 5, wherein the stabilizer of the (F) component is isopropyl borate, aluminum chelate, or barbituric acid. ### Claim 7 (depends on 1) The resin composition according to claim 1, further comprising (G) a coupling agent. ### Claim 8 (depends on 1) A one-component adhesive agent comprising the resin composition according to claim 1. ### Claim 9 (depends on 1) A cured resin obtained by heating the resin composition according to claim 1. ### Claim 10 (depends on 8) An image sensor module manufactured with the one-component adhesive agent according to claim 8. ### Claim 11 (depends on 8) An electronic component manufactured with the one-component adhesive agent according to claim 8. ### Claim 12 (depends on 2) The resin composition according to claim 2, further comprising (E) a filler. ### Claim 13 (depends on 2) The resin composition according to claim 2, further comprising (F) a stabilizer. ### Claim 14 (depends on 2) The resin composition according to claim 2, further comprising (G) a coupling agent. ### Claim 15 (depends on 2) A one-component adhesive agent comprising the resin composition according to claim 2. ### Claim 16 (depends on 2) A cured resin obtained by heating the resin composition according to of claim 2.