Back to results
US 10,246,323 B2Granted
Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus
AssigneeGoertek Inc.
InventorsMengjin Cai, Qinglin Song
Life of this patent
Estimating the term…
Abstract
A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.
Claims9
A method for forming a cavity in a MEMS pressure sensor chip, comprising:
- forming a first groove in a substrate;
- bonding a covering layer onto the substrate to cover the first groove, so as to form a cavity;
- and
- etching the covering layer to lower the thickness of the covering layer,
- wherein the step of etching the covering layer further comprises:
- patterning the covering layer to etch a portion of the covering layer corresponding to the cavity, with other portions of the covering layer remaining.
3 more elements
Dependencies are inferred from the claim text.