# US 10,246,322 B2 · Distributed sensor system > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,246,322 B2 - Document ID: US10246322B2 - Status: Granted - Kind: B2 - Application number: 14/207,477 - Filed: 2014-03-12 - Published: 2014-09-18 - Granted: 2019-04-02 - Earliest claimed: 2013-03-15 - Assignees: Versana Micro Inc. - Applicants: Versana Micro Inc. - Inventors: Bishnu Prasanna Gogoi - Web page: https://patentgrep.com/patent/US10246322B2 ## CPC - B81B 7/02: containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) - H05K 7/02: Arrangements of circuit components or wiring on supporting structure - H10B 61/00: Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices - H10N 19/00: Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00 - H10N 30/302: {Sensors} - H10N 30/308: {Membrane type} - H10N 59/00: Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 (MRAM devices H10B61/00) - B81B 2201/0207: Bolometers - B81B 2201/0214: Biosensors; Chemical sensors - B81B 2201/0228: Inertial sensors - B81B 2201/0257: Microphones or microspeakers - B81B 2201/0264: Pressure sensors - B81B 2201/0278: Temperature sensors - B81B 2207/012: the micromechanical device and the control or processing electronics being separate parts in the same package - B81B 2207/05: Arrays - B81B 2207/09: Packages - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10B: ELECTRONIC MEMORY DEVICES - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR ## Abstract A distributed sensor system is disclosed that provides spatial and temporal data in an operating environment. The distributed sensor nodes can be coupled together to form a distributed sensor system. For example, a distributed sensor system comprises a collection of Sensor Nodes (SN) that are physically coupled and are able to collect data about the environment in a distributed manner. An example of a distributed sensor system comprises a first sensor node and a second sensor node. Each sensor node has a plurality of sensors or a MIMS device. Each sensor node can also include electronic circuitry or a power source. A joint region is coupled between a first flexible interconnect region and a second flexible interconnect region. The first sensor node is coupled to the first flexible interconnect region. Similarly, the second sensor node is coupled to the second flexible interconnect region. ## Claims ### Claim 1 A distributed sensor system comprising: a first sensor node comprising a plurality of sensors formed on or coupled to a substrate; a first flexible interconnect region coupled to the first sensor node; a first joint region coupled to the first flexible interconnect region; a second flexible interconnect region coupled to the first joint region; and a second sensor node coupled to the second flexible interconnect wherein the first joint region is configured to be decoupled from the first flexible interconnect region or the second flexible interconnect region wherein the first joint region is replaced with a second joint region that is shorter or longer than the first joint region when recoupled to the first flexible interconnect region or the second flexible interconnect region such that the length between the first sensor node and the second sensor node is decreased or increased. ### Claim 2 (depends on 1) The distributed sensor system of claim 1 wherein the first joint region has a first length and wherein in the second joint region is the first joint region shortened to a second length that is shorter than the first length. ### Claim 3 (depends on 1) The distributed sensor system of claim 1 wherein the at least one joint region, the first flexible interconnect, or the second flexible interconnect comprises a metal or a metal alloy that enables the scaling of the length of the distributed sensor system. ### Claim 4 (depends on 3) The distributed sensor system of claim 3 wherein the metal or metal alloy of the first joint region comprises at least one of Au/Sn, Sn/Ag/Cu, Sn/Ag, or a solder. ### Claim 5 (depends on 1) The distributed sensor system of claim 1 wherein the first or second flexible interconnect regions comprises parylene that supports multi-axis degrees of freedom, and wherein the first or second flexible interconnect regions includes conductive traces. ### Claim 6 (depends on 1) The distributed sensor system of claim 1 further including an attachment region wherein the attachment region is coated with an adhesion layer. ### Claim 7 (depends on 6) The distributed sensor system of claim 6 further including a plurality of adhesion layers separated by protective layers and wherein a spent or decoupled adhesion layer can be removed by removing an underlying protective layer thereby exposing a new adhesion layer. ### Claim 8 (depends on 6) The distributed sensor system of claim 6 wherein the adhesion layer is activated by ultraviolet light. ### Claim 9 (depends on 1) The distributed sensor system of claim 1 wherein the first joint region is configured to couple by a local vacuum and wherein the first joint region is configured to be decoupled by overcoming the local vacuum. ### Claim 10 (depends on 1) The distributed sensor system of claim 1 wherein the first joint region is configured to couple by micro-rivets or pins or wherein the first joint region is configured to couple by a micro-velcro structure or wherein the first joint region can be decoupled by overcoming the micro-velcro structure. ### Claim 11 (depends on 1) The distributed sensor system of claim 1 wherein the first joint region is configured to be coupled by magnetic force and wherein the first joint region is configured to be decoupled by overcoming the magnetic force. ### Claim 12 A distributed sensor system comprising a plurality of sensor nodes coupled together by a plurality of flexible interconnect regions, wherein the plurality of flexible interconnect regions are configured to provide multiple degrees of freedom that support following surface contours or sudden changes of direction, where the flexible interconnect comprises a polymer, wherein the distributed sensor system further includes a joint region coupled between at least two sensor nodes of the plurality of sensor nodes, wherein the joint region is configured to be decoupled and recoupled to support shortening or lengthening a distance between the two sensor nodes of the plurality of sensor nodes, wherein the joint region is configured to be replaced with a longer joint region, and wherein the longer joint region is configured to be recoupled between the two sensor nodes of the plurality of sensor nodes. ### Claim 13 (depends on 12) The distributed sensor system of claim 12 wherein the joint region is configured to be shortened and wherein the shortened joint region is configured to be recoupled to shorten the distance between the two sensor nodes of the plurality sensor nodes. ### Claim 14 (depends on 13) The distributed sensor system of claim 13 wherein one or more joint regions are configured to be coupled between the at least two sensor nodes to increase or decrease a distance between the at least two sensor nodes. ### Claim 15 (depends on 12) The distributed sensor system of claim 12 wherein the joint region couples to at least one of the plurality of flexible interconnect region and includes conductive traces that enables the scaling of the length of the distributed sensor. ### Claim 16 (depends on 15) The distributed sensor system of claim 15 further including an attachment region wherein the attachment region is coated with an adhesion layer that retains the at least one joint region to the attachment region. ### Claim 17 (depends on 16) The distributed sensor system of claim 16 wherein the joint region or the attachment region includes a plurality of adhesion layers separated by protective layers and wherein a spent or decoupled adhesion layer can be removed by removing an underlying protective layer thereby exposing a new adhesion layer. ### Claim 18 (depends on 16) The distributed sensor system of claim 16 wherein the adhesion layer is activated by ultraviolet light. ### Claim 19 (depends on 12) The distributed sensor system of claim 12 wherein at least one of the plurality of flexible interconnect regions is configured to be coupled by magnetic force and wherein the at least one of the plurality of flexible interconnect is configured to be decoupled by overcoming the magnetic force. ### Claim 20 A distributed sensor system comprising: a plurality of sensor nodes; an interconnect regions coupled to at least one of the plurality of sensor nodes; and a joint region coupled between two sensor nodes of the plurality of sensor nodes wherein the joint region is configured to be coupled, decoupled, and recoupled to lengthen or shorten a distance between the two sensor nodes of the plurality of sensor nodes in the distributed sensor system wherein the joint is configured to be shortened and recoupled to shorten the distance between the two sensor nodes.