# US 10,246,321 B2 · MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device

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- Number: US 10,246,321 B2
- Document ID: US10246321B2
- Status: Granted
- Kind: B2
- Application number: 15/698,459
- Filed: 2017-09-07
- Published: 2018-04-05
- Granted: 2019-04-02
- Earliest claimed: 2016-09-30
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Masashi Yoshiike
- Web page: https://patentgrep.com/patent/US10246321B2

## CPC

- B81B 7/007: {Interconnections between the MEMS and external electrical signals}
- B41J 2/14: Structure thereof {only for on-demand ink jet heads}
- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/1607: {Production of print heads with piezoelectric elements (B41J2/1606, B41J2/162 take precedence)}
- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/1621: {Manufacturing processes}
- B41J 2/1626: {etching}
- B41J 2/1628: {dry etching}
- B41J 2/1629: {wet etching}
- B41J 2/1631: {photolithography}
- B81C 1/00301: {Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias}
- B41J 2002/14362: {Assembling elements of heads}
- B41J 2002/14491: {Electrical connection}
- B81B 2201/052: Ink-jet print cartridges
- B81B 2207/07: Interconnects
- B81C 2201/013: Etching
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01)

## Abstract

There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.

## Claims

### Claim 1

A MEMS device comprising:
a substrate having a resin portion that protrudes from one surface thereof and is made of a resin and a first wiring that covers at least a portion of a surface of the resin portion,
wherein the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and
wherein a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction,
wherein the resin portion includes a first portion and a second portion that is adjacent to the first portion along the second direction and of which a height from the one surface is lower than that of the first portion,
wherein the first wiring is provided at a position overlapping the first portion,
wherein a width of the first portion is equal to or larger than the width of the first wiring covering the first portion in the second direction,
wherein a second wiring is between the first portion and the first wiring,
wherein a width of the second wiring is equal or larger than the width of the first wiring covering the first portion in the second direction, and
wherein the width of the second wiring is larger than the width of the first portion in the second direction.

### Claim 2 (depends on 1)

A liquid ejecting head which includes a nozzle for ejecting a liquid, comprising:
a structure of the MEMS device according to claim 1.

### Claim 3 (depends on 2)

A liquid ejecting apparatus comprising:
the liquid ejecting head according to claim 2.